SNVSC74D September   2023  – October 2026 LP5813

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Synchronous Boost Converter
        1. 7.3.1.1 Undervoltage Lockout
        2. 7.3.1.2 Enable and Soft Start
        3. 7.3.1.3 Switching Frequency
        4. 7.3.1.4 Current Limit Operation
        5. 7.3.1.5 Boost PWM Mode
        6. 7.3.1.6 Boost PFM Mode
        7. 7.3.1.7 Pass-Through Mode
      2. 7.3.2 Time-Cross-Multiplexing (TCM) Scheme
        1. 7.3.2.1 Direct drive mode
        2. 7.3.2.2 TCM Drive Mode
        3. 7.3.2.3 Mix drive mode
        4. 7.3.2.4 Ghosting Elimination
      3. 7.3.3 Analog Dimming
      4. 7.3.4 PWM Dimming
      5. 7.3.5 Autonomous Animation Engine Control
        1. 7.3.5.1 Animation Engine Pattern
        2. 7.3.5.2 Sloper
        3. 7.3.5.3 Animation Engine Unit (AEU)
        4. 7.3.5.4 Animation Pause Unit (APU)
      6. 7.3.6 Protections and Diagnostics
        1. 7.3.6.1 Overvoltage Protection
        2. 7.3.6.2 Output Short-to-Ground Protection
        3. 7.3.6.3 LED Open Detections
        4. 7.3.6.4 LED Short Detections
        5. 7.3.6.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  9. 8 Register Map Table
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Parameters
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Inductor Selection
        2. 9.2.3.2 Output Capacitor Selection
        3. 9.2.3.3 Input Capacitor Selection
        4. 9.2.3.4 Program Procedure
        5. 9.2.3.5 Programming Example
      4. 9.2.4 Application Performance Plots
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

11 Revision History

Changes from Revision C (February 2025) to Revision D (October 2026)

  • Add the body diode of the scan switch FETGo
  • Add ghosting elimination circuits clamp enable or disable logic description and typical pull up or pull down current capabilityGo

Changes from Revision B (December 2024) to Revision C (February 2025)

  • Added URL to Sample CodeGo

Changes from Revision A (July 2024) to Revision B (December 2024)

  • Added Pin Configuration SectionGo
  • Removed Recommended Inductors tableGo
  • Changed Program ProcedureGo
  • Changed Program ExampleGo

Changes from Revision * (September 2023) to Revision A (July 2024)

  • Added OUT0, OUT1, OUT2, OUT3, EN, SCL, SDA, SYNC Voltage on parameter to the Recommended Operating ConditionsGo
  • Added LP5810/2 and LP5813 WSON information to the Thermal Information TableGo
  • Updated Standby Current in the Electrical Characteristics TableGo
  • Added Programming ExampleGo