For related documentation see the
following:
- Texas Instruments, Thermal Design by Insight not
Hindsight application note
- Texas Instruments, A Guide to Board Layout for
Best Thermal Resistance for Exposed Pad Packages application note
- Texas Instruments, AN-2162 Simple Success With Conducted EMI From DC/DC
Converters application note
- Texas Instruments, Semiconductor and IC Package
Thermal Metrics application note
- Texas Instruments, Thermal Design
Made Simple with LM43603 and LM43602 application note
- Texas Instruments, PowerPAD™
Thermally Enhanced Package application note
- Texas Instruments, PowerPAD™ Made
Easy application note
- Texas Instruments, Using New Thermal Metrics
application note
- Texas Instruments, Layout Guidelines for
Switching Power Supplies application note
- Texas Instruments, Simple Switcher PCB Layout
Guidelines application note
- Texas Instruments, Constructing Your Power
Supply- Layout Considerations Seminar
- Texas Instruments, Low Radiated EMI Layout Made
Simple with LM4360x and LM4600x application note