Figure 4-2 through Figure 4-5 show the board layout for the LM5169PEVM.

The 8-pin NGU PowerPAD integrated circuit package offers an exposed thermal pad, which must be soldered to the copper landing on the PCB for best thermal performance. The PCB consists of a 4-layer design. There are 2-oz copper planes on the top and bottom and 1-oz copper mid-layer planes to dissipate heat with an array of thermal vias under the thermal pad to connect to all four layers.

Figure 4-2 Top Layer

Figure 4-3 Mid-Layer 1 Ground Plane

Figure 4-4 Mid-Layer 2 Routing

Figure 4-5 Bottom Layer