SPRADP5A January   2026  – September 2026 AM62P , AM62P-Q1

 

  1.   1
  2.    AM62Px eMMC HS400 IBIS Model Simulation Methodology
  3.   Trademarks
  4. 1Overview
    1. 1.1 Board Designs Supported
    2. 1.2 General Board Layout Guidelines
    3. 1.3 PCB Stackup
    4. 1.4 Bypass Capacitors
      1. 1.4.1 Bulk Bypass Capacitors
      2. 1.4.2 High-Speed Bypass Capacitors
    5. 1.5 Velocity Compensation
  5. 2eMMC Board Design and Layout Guidance
    1. 2.1 eMMC Introduction
    2. 2.2 eMMC Signal Termination
    3. 2.3 Signal Routing Specification
    4. 2.4 Power Supply Design
  6. 3eMMC Board Design Simulations
    1. 3.1 Board Model Extraction
    2. 3.2 Board-Model Validation
    3. 3.3 Capacitor Loop Inductance
    4. 3.4 AC Impedance
    5. 3.5 IBIS Model Simulations
      1. 3.5.1 Simulation Setup
      2. 3.5.2 Simulation Bit Patterns
      3. 3.5.3 Simulation Best Practices
      4. 3.5.4 Simulation Strategy and Examples
      5. 3.5.5 Pass/Fail Checks
  7. 4Design Example
    1. 4.1 Stackup
    2. 4.2 Power Routing
    3. 4.3 Signal Routing
  8. 5Summary
  9. 6References
  10. 7Revision History

2.2 eMMC Signal Termination

No external pulls are required for the AM62Px MMC0 eMMC signals since the PHY enables and controls the internal pulls as required for an eMMC.

Pullups for DAT[7:0] and CMD are internally enabled during reset and after reset. A pulldown is enabled for the DS and the clock output (CLK) is driven low after reset. There are no PADCONFIG registers associated with the MMC0 pins. The internal pulls associated with the MMC0 pins are dynamically controlled by the MMC0 host and PHY.

External pulls are not a requirement for the eMMC Data, CMD, DS, or the CLK signals.

Refer to AM62P, AM62P-Q1 Processor Family Schematic Design Guidelines and Schematic Review Checklist