SPRUJ21D October   2022  – February 2024

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Inside the Box
    2. 1.2 Key Features and Interfaces
    3. 1.3 Thermal Compliance
    4. 1.4 EMC, EMI, and ESD Compliance
  5. 2User Interfaces
    1. 2.1 Power Input
      1. 2.1.1 Power Input [J14] With LED for Status [LD3]
      2. 2.1.2 Power Budget Considerations
    2. 2.2 User Inputs
      1. 2.2.1 Board Configuration Settings [SW1]
      2. 2.2.2 Reset Pushbutton [SW2]
      3. 2.2.3 User Pushbutton [SW3] With User LED Indication [LD2]
    3. 2.3 Standard Interfaces
      1. 2.3.1 Uart-Over-USB [J4] With LED for Status [LD1]
      2. 2.3.2 Gigabit Ethernet [J8] With Integrated LEDs for Status
      3. 2.3.3 JTAG/Emulation Interface [J9]
      4. 2.3.4 USB3.1 Gen1 Interfaces [J10] [J12]
      5. 2.3.5 M.2 Key E Connector [J11] for Wi-Fi Networking Modules
      6. 2.3.6 Stacked DisplayPort and HDMI Type A [J13]
      7. 2.3.7 M.2 Key M Connector [J22] for SSD Modules
      8. 2.3.8 MicroSD Card Cage [J23]
    4. 2.4 Expansion Interfaces
      1. 2.4.1 Heatsink [ACC1] With [J16] Fan Header
      2. 2.4.2 CAN-FD Connector(s) [J1] [J2] [J5] [J6]
      3. 2.4.3 Expansion Header [J3]
      4. 2.4.4 Camera Interface, 15-Pin Flex Connectors [J18] [J19]
      5. 2.4.5 Camera Interface, 40-Pin High Speed [J24]
      6. 2.4.6 Automation and Control Connector [J25]
  6. 3Mechanicals
  7. 4Circuit Details
    1. 4.1 Top Level Diagram
    2. 4.2 Interface Mapping
    3. 4.3 I2C Address Mapping
    4. 4.4 GPIO Mapping
    5. 4.5 Identification EEPROM
  8. 5Usage Notes and Advisories
    1. 5.1 Usage Notes
    2. 5.2 Advisories
  9. 6References
  10. 7Revision History

5.2 Advisories

i002: The processor can reset due to over-heating when operating at higher loading and/or environment with elevated temperatures.

Details: At the time of creating this advisory, the default SDK does not include thermal monitoring/management. When operating the processor at higher loading, the temperature can become elevated and eventually exceed its maximum device temperature causing the processor to reset. The included heatsink does help with thermal dissipation, but additional thermal management may be needed for some applications.

Workaround(s): Adding a fan to the heatsink or increasing air-flow across the SK will help reduce the temperature of the processor and will eliminate the thermal reset condition in most circumstances.

Quantity Description Manufacturer Part Number
1 DC Fan, 5 Volt, 25 mm x 25 mm(1) CUI Devices CFM-2510b-0130-275(3)
2 Screw TBD TBD
1 Connector Housing, 3 Pos, Female, 2.54 mm(2) Wurth Elektronik 61900311621
2 Connector Socket, 22-28AWG, Crimp Wurth Elektronik 61900113722DEC
(1) TBD Fan direction (blow downward or upward)
(2) Attach fan’s black wire to housing connector position 2 (middle), red wire to position 3 (away from board edge). Pin 1 is open (board edge)
(3) Manufacture part numbers are included as reference. They can be replaced with compatible components from other manufactures.

i003: The board can reset when using SSD drives and/or higher processor loading.

Details: For Revision A and previous versions only. Version A1 and later revisions have updated design to resolve this item. The power regulator supplying power to the processor and PCIe M.2 slots is under-sized, and some applications can cause the regulator to reset when higher loading occurs. Operating the SK at elevated temperatures can also cause the application to draw additional power also causing the regulator to be over-loaded.

Workaround(s): Keeping the processor/SK at lower temperatures with a fan or other means will reduce the required power. The circuit components can be updated to increase the power capacity of on-board regulator. See below of a list of components to be updated.

Reference Description Manufacturer Part Number
L15 Power Inductor, 1.2uH, 21.6 A, 20% Coilcraft XAL7070-122MEC
R134 Resistor, 1m-Ohm, 0.5W, 1206 package STACKPOLE ELECTRONICS CSNL1206FT1L00(1)
R123 Resistor, 649-Ohms, 0.1W, 0402 package PANASONIC-ECG ERJ-2RKF6490X(1)
C268 Capacitor, Ceramic, 0.047uF, 25V, 0402 package Murata GRM155R71E473JA88D(1)
C272 Capacitor, Ceramic, 1000pF, 16V, 0402 package Kemet C0402C102M4REC7867(1)
(1) Manufacture part numbers are included as reference. They can be replaced with compatible components from other manufactures.