SPRUJ31 april   2022

 

  1.   1
  2.   C2000 F28003x Series LaunchPad Development Kit
  3.   Trademarks
  4. 1Board Overview
    1. 1.1 Kit Contents
    2. 1.2 Features
    3. 1.3 Specifications
    4. 1.4 Using the F28003x LaunchPad
    5. 1.5 BoosterPacks
    6. 1.6 Hardware Revisions
      1. 1.6.1 Revision A
  5. 2Software Development
    1. 2.1 Software Tools and Packages
    2. 2.2 F28003x LaunchPad Demo Program
    3. 2.3 Programming and Running Other Software on the F28003x LaunchPad
  6. 3Hardware Description
    1. 3.1 Functional Description and Connections
      1. 3.1.1  Microcontroller
      2. 3.1.2  Power Domains
      3. 3.1.3  LEDs
      4. 3.1.4  Encoder Connectors
      5. 3.1.5  FSI
      6. 3.1.6  CAN
      7. 3.1.7  CLB
      8. 3.1.8  Boot Modes
      9. 3.1.9  BoosterPack Sites
      10. 3.1.10 Analog Voltage Reference Header
      11. 3.1.11 Other Headers and Jumpers
        1. 3.1.11.1 USB Isolation Block
        2. 3.1.11.2 BoosterPack Site 2 Power Isolation
        3. 3.1.11.3 Alternate Power
    2. 3.2 Debug Interface
      1. 3.2.1 XDS110 Debug Probe
      2. 3.2.2 XDS110 Output
      3. 3.2.3 Virtual COM Port
    3. 3.3 Alternate Routing
      1. 3.3.1 Overview
      2. 3.3.2 UART Routing
      3. 3.3.3 EQEP Routing
      4. 3.3.4 CAN Routing
      5. 3.3.5 FSI Routing
      6. 3.3.6 X1/X2 Routing
      7. 3.3.7 PWM DAC
  7. 4Board Design
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 BOM
    4. 4.4 LAUNCHXL-F280039C Board Dimensions
  8. 5Frequently Asked Questions
  9. 6References
    1. 6.1 Reference Documents
    2. 6.2 Other TI Components Used in This Design

3.1.2 Power Domains

The F28003x LaunchPad has several power domains that can be connected or isolated from each other with removable shunts. The different 3.3 V and 5 V power domains are further described in Figure 3-2 and Figure 3-3.

GUID-20211228-SS0I-TXZH-M5LM-SSDBZSRP1SGQ-low.svg Figure 3-2 LaunchPad Power Distribution Diagram
GUID-20211228-SS0I-BBH6-PWHT-V3FKZFLJ7KW4-low.svg Figure 3-3 LaunchPad Power Plane Diagram

Table 3-1 describes the usage of the different removable shunts on the LaunchPad board.

Table 3-1 Power Domain Shunts
Shunt Identifier Usage Description

JP1, +5V0

 Connects the +5 V power from the USB-C connector (+5V0_USB) to the +5 V power on the XDS110 side of the board (+5V0_XDS110). Bridges the power and ground isolations between the two board sides.

JP1, GND

 Connects the board Ground on the isolated USB-C connector side of the board (USB_GND) to the rest of the board ground (GND). Bridges the power and ground isolations between the two board sides.
JP2, +5V0 Connects the +5 V power on the XDS110 side of the board (+5V0_XDS110) to the +5 V power on the F280039C side of the board (+5V0_MCU).
JP2, +3V3 Connects the +3.3 V power on the XDS110 side of the board (+3V3_XDS110) to the +3.3 V power on the F280039C side of the board (+3V3_MCU).