SPRY356 October   2026 ADS7142 , DRV8426

 

  1.   1
  2.   en-us Overview
  3.   At a glance
  4.   Introduction
  5.   Comparing today's thermal management architectures
    1.     Air-to-air
    2.     Air-to-liquid
    3.     Liquid-to-air
  6.   Evolution of liquid cooling technology
  7.   The need for leak sensing
  8.   Immersion cooling
  9.   Future AI data center cooling trends
  10.   Conclusion
  11.   About the author
  12.   Additional resources
  13.   Trademarks

About the author

David Stout is a systems engineer focused on building automation systems, including data center thermal management at Texas Instruments. He has more than 30 years of experience designing analog, mixed-signal and radio-frequency circuits and systems for the industrial semiconductor market. David has a bachelor's degree in electrical engineering from Louisiana State University and a master's degree in electrical engineering from the University of Texas at Dallas.