STDA037 August   2026 MSPM33C321A , MSPM33C321A-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2The Three Entry Barriers for Automotive Chips
  6. 3Advantages of MSPM33 in Automotive BEL Applications
    1. 3.1 Hardware and Chip-Level Features
    2. 3.2 Software and Ecosystem Support
    3. 3.3 MSP Edge AI Capability
  7. 4MSPM33C32 Overview
  8. 5Headlight Application
  9. 6Body Control Module Application
  10. 7Resources

5 Headlight Application

  1. Rich tailored peripherals
    • 20x PWM channels: drives multiple LED strings, matrices, cooling fans, and stepper motors (light position).
    • 20x ADC channels: provides simultaneous multi-channel sampling for precise NTC temperature and voltage monitoring.
  2. Dense communication matrix
    • Four CAN-FD: Enables high-speed backbone communication with the Body Control Module (BCM) or off-board networks.
    • Four SPI: an excellent choice for high-speed, multi-channel control of premium LED drivers (for example, TPS92682 and TPS92520).
    • Three UART and 2x I2C: Connects seamlessly with local DC/DC regulators and auxiliary sensors.
  3. High performance and computation
    • 160MHz Cortex®-M33 with FPU: delivers plenty of math-heavy processing power needed for complex matrix LED/ADB pixel-level algorithms without latency.
  4. Advanced security and memory
    • Arm TrustZone and Immutable RoT: secures firmware against hacking, providing secure boot and hardware-isolated partitions.
    • Large Memory with ECC: up to 1MB Flash and 256kB SRAM with error correction code (ECC) to prevent data corruption caused by harsh automotive EMI.
  5. Seamless automotive ecosystem
    • AUTOSAR support: includes MCAL drivers to fast-track standard automotive software development.
MSPM33C32 MSPM33C321A MSPM33C321A-Q1 Headlight Application Block DiagramFigure 5-1 Headlight Application Block Diagram