To minimize porting complexity for customers, the TI SimpleLink family ensures pin-to-pin compatibility between chips of the same package and version. This means upgrading from CC1310 RGZ (7mm × 7mm) VQFN to CC1311R3 RGZ (7mm × 7mm) VQFN requires no PCB redesign — only the crystal oscillator needs replacement. It is important to note that while the CC1311P RGZ shares the same package as the CC1310R RGZ, the inclusion of an internal PA means the R and P versions are not pin-to-pin compatible. A new PCB design is required.

CC1311 comprises two versions: CC1311R3 and CC1311P3. Where the RGZ package (7x7mm QFN) of CC1311R3 is pin to pin compatible with the identically packaged CC1310. If CC1310 in the RGZ package was previously used, the pin to pin can be ported directly to CC1311R3 without any changes to the PCB layout.

In terms of peripheral circuitry, the only change is the high-speed crystal oscillator. The CC1311 requires a 48MHz crystal oscillator to provide the system clock, while the CC1310 uses 24MHz.

For specific hardware migration guidelines, refer to Hardware Migration From CC1310 to CC1312R. The document title includes CC1312R because the CC1312R chip is also compatible with CC1310 and CC1311. Consequently, this document may be directly used as a guide for porting from CC1310 to CC1311R.

If the CC1311P3 version is selected, the P version incorporates an integrated power amplifier. Therefore, it cannot be directly substituted for the CC1310 on a pin to pin basis. For the P version of the hardware design, refer to CC13xx/CC26xx Hardware Configuration and PCB Design Considerations document.