SWRS350 December   2025 IWRL6432WMOD

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Terminal Configurations and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Signal Descriptions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Recommended Operating Conditions
    3. 6.3  System Topologies
      1. 6.3.1 Autonomous Mode
      2. 6.3.2 Secondary Device Mode
    4. 6.4  Module Power Management
    5. 6.5  Peak Current Requirement per Voltage Rail
    6. 6.6  RF Specification
    7. 6.7  Antenna Position
      1. 6.7.1 2D Antenna Array With 3D Detection Capability
    8. 6.8  Antenna Gain Plot
      1. 6.8.1 Transmitter Gain Plots
      2. 6.8.2 Receiver Gain Plot
    9. 6.9  Thermal Resistance Characteristics
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1 Power Supply Sequencing and Reset Timing
      2. 6.10.2 MultiChannel buffered / Standard Serial Peripheral Interface (McSPI)
        1. 6.10.2.1 SPI Timing Conditions
        2. 6.10.2.2 SPI—Peripheral Mode
          1. 6.10.2.2.1 Timing and Switching Requirements for SPI - Peripheral Mode
          2. 6.10.2.2.2 Timing and Switching Characteristics for SPI Output Timings—Secondary Mode
      3. 6.10.3 Dedicated Input/Output
        1. 6.10.3.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      4. 6.10.4 Serial Communication Interface (SCI)
        1. 6.10.4.1 SCI Timing Requirements
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Module Images
    2. 7.2 Functional Block Diagram
    3. 7.3 Subsystems
      1. 7.3.1 Host Interface
      2. 7.3.2 Software
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Application Information
    2. 8.2 Test Results
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Device Marking
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Reflow Information
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, IWRL6432W). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDXDevelopment-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDSFully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, MBB0030A), the temperature range (for example, blank is the default commercial temperature range). Figure 9-1 provides a legend for reading the complete device name for any IWRL6432WMOD device.

For orderable part numbers of IWRL6432WMOD devices in the MBB0030A package types, see the Package Option Addendum of this document (when available), the TI website (www.ti.com), or contact your TI sales representative.

For additional description of the device nomenclature markings on the die, see the Device Marking.

IWRL6432WMOD Production Device Nomenclature Figure 9-1 Production Device Nomenclature
IWRL6432WMOD Pre-production Device Nomenclature Figure 9-2 Pre-production Device Nomenclature