TIDUF64 December   2023

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 DC-DC Boost Converter
      2. 2.2.2 Bidirectional DC-DC Converter
      3. 2.2.3 DC-AC Converter
    3. 2.3 Highlighted Products
      1. 2.3.1  TMDSCNCD280039C - TMS320F280039C Evaluation Module C2000™ MCU controlCARD™
      2. 2.3.2  LMG3522R030 650-V 30-mΩ GaN FET With Integrated Driver, Protection and Temperature Reporting
      3. 2.3.3  TMCS1123 - Precision Hall-Effect Current Sensor
      4. 2.3.4  AMC1302 - Precision, ±50-mV Input, Reinforced Isolated Amplifier
      5. 2.3.5  ISO7741 Robust EMC, Quad-channel, 3 Forward, 1 Reverse, Reinforced Digital Isolator
      6. 2.3.6  ISO7762 Robust EMC, Six-Channel, 4 Forward, 2 Reverse, Reinforced Digital Isolator
      7. 2.3.7  UCC14131-Q1 Automotive, 1.5-W, 12-V to 15-V VIN, 12-V to 15-V VOUT, High-Density > 5-kVRMS Isolated DC/DC Module
      8. 2.3.8  ISOW1044 Low-Emissions, 5-kVRMS Isolated CAN FD Transceiver With Integrated DC/DC Power
      9. 2.3.9  ISOW1412 Low-Emissions, 500kbps, Reinforced Isolated RS-485, RS-422 Transceiver With Integrated Power
      10. 2.3.10 OPA4388 Quad, 10-MHz, CMOS, Zero-Drift, Zero-Crossover, True RRIO Precision Operational Amplifier
      11. 2.3.11 OPA2388 Dual, 10-MHz, CMOS, Zero-Drift, Zero-Crossover, True RRIO Precision Operational Amplifier
      12. 2.3.12 INA181 26-V Bidirectional 350-kHz Current-Sense Amplifier
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
      1. 3.2.1 DC-DC Boost Stage
      2. 3.2.2 Bidirectional DC-DC Stage
    3. 3.3 Test Results
      1. 3.3.1 DC-DC Boost Converter
      2. 3.3.2 Bidirectional DC-DC Converter
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

1.1 Key System Specifications

Since this reference design is split into three main stages, the key specifications for each stage is defined individually. Table 1-1 shows the key specifications for the DC-AC converter, Table 1-2 for the DC-DC boost converter and Table 1-3 for the bidirectional DC-DC converter.

Table 1-1 Key System Specifications: DC-AC Stage
PARAMETER SPECIFICATION

Maximum | Nominal DC input voltage

520 V | 400 V

Rated output voltage

230 V

Rated output power

3.6 kW

Switching frequency

100 kHz

Power factor

± Active, ±Reactive

Ambient temperature range

–40°C to +60°C

Cooling

Static cooling or natural convection

Heat sink thermal resistance

0.3°C/W

Total harmonic distortion (THD)

< 5%

DC link capacitance

640 μF

DC link ripple voltage

±22 V
Table 1-2 Key System Specifications: DC-DC Boost Stage
PARAMETER SPECIFICATION

String input voltage

50 V to 500 V (up to 10 panels per string)

Short circuit current

18 A

Nominal DC current

11 A | string
Maximum | Nominal DC output voltage 520 V | 400 V

Rated output power

7.2 kW

Switching frequency

120 kHz
Ambient temperature range –40°C to +60°C
Table 1-3 Key System Specifications: Bidirectional DC-DC Stage
PARAMETER SPECIFICATION
Maximum | Nominal DC link voltage 520 V | 400 V
Charging | Discharging current 30 A | 30 A
Battery voltage range 80 V to 500 V
Maximum output power 7.2 kW
Switching frequency 60 kHz each leg
Ambient temperature range –40°C to +60°C
GUID-E6E50D60-2200-40DA-9902-3DC3155245EF-low.gif
CAUTION:

Do not leave the design powered when unattended.
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WARNING:

High voltage! Accessible high voltages are present on the board. Electric shock is possible. The board operates at voltages and currents that can cause shock, fire, or injury if not properly handled. Use the equipment with necessary caution and appropriate safeguards to avoid injuring yourself or damaging property. For safety, use of isolated test equipment with overvoltage and overcurrent protection is highly recommended.

TI considers it the user's responsibility to confirm that the voltages and isolation requirements are identified and understood before energizing the board or simulation. When energized, do not touch the design or components connected to the design.
GUID-D9BEBC20-188D-4CBD-A202-356FDC060593-low.gif
WARNING:

Hot surface! Contact can cause burns. Do not touch!

Some components can reach high temperatures > 55°C when the board is powered on. Do not touch the board at any point during operation or immediately after operating, as high temperatures can be present.
GUID-E6E50D60-2200-40DA-9902-3DC3155245EF-low.gif
WARNING:

TI intends this reference design to be operated in a lab environment only and does not consider the design as a finished product for general consumer use. The design is intended to be run at ambient room temperature and is not tested for operation under other ambient temperatures.

TI intends this reference design to be used only by qualified engineers and technicians familiar with risks associated with handling high-voltage electrical and mechanical components, systems, and subsystems.

There are accessible high voltages present on the board. The board operates at voltages and currents that can cause shock, fire, or injury if not properly handled or applied. Use the equipment with necessary caution and appropriate safeguards to avoid injuring yourself or damaging property.