SBOSAA1E April   2022  – December 2022 OPA2310 , OPA310 , OPA4310

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information for Single Channel
    5. 7.5 Thermal Information for Dual Channel
    6. 7.6 Thermal Information for Quad Channel
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Operating Voltage
      2. 8.3.2  Rail-to-Rail Input
      3. 8.3.3  Rail-to-Rail Output
      4. 8.3.4  Capacitive Load and Stability
      5. 8.3.5  Overload Recovery
      6. 8.3.6  EMI Rejection
      7. 8.3.7  ESD and Electrical Overstress
      8. 8.3.8  Input ESD Protection
      9. 8.3.9  Shutdown Function
      10. 8.3.10 Packages with an Exposed Thermal Pad
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 OPAx310 Low-Side, Current Sensing Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4.     Trademarks
    5. 10.4 Electrostatic Discharge Caution
    6. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • High output current: ±150-mA typical ISC at 5.5 V
  • Fast enable from shutdown: 0.9-µs typical
  • Wide operational supply voltage: 1.5 V to 5.5 V
  • Low input offset voltage: ±250-µV typical
  • Fail-safe inputs: No diode from inputs to V+
  • Optimized quiescent current: 165-µA/ch typical
  • Rail-to-rail input and output
  • Gain bandwidth product: 3-MHz typical at 5.5 V
  • Thermal noise floor: 16-nV/√Hz typical
  • Unity-gain stable
  • Drives up to 250-pF without sustained oscillations
  • Internal RFI and EMI filtered input pins
  • Operating temperature range: –40°C to 125°C