Join us at APEC 2026
Innovating what’s next in power
As power demands escalate and electrification accelerates, the way we generate, convert and distribute power is reshaping our world. Backed by decades of innovation and more than 80,000 analog and embedded processing products, we help you solve your greatest power design challenges. Whether maximizing efficiency in data centers, enabling automotive electrification, or powering sustainable energy and robotic systems, our solutions scale with your vision. From high-density gallium nitride solutions to breakthrough power modules, we're innovating what's next in power at APEC 2026.
| Time | Location | Session Title | Speaker(s) |
|---|---|---|---|
| 09:30 | Professional Educational Seminar - S03/214CD | Advanced Gate Driver Technologies: Integrated, Resonant, Self-Powered, and Optical Solutions | Pengkun Liu |
| 14:30 | Professional Education Seminar - S09/207AB | Digital Power Control Introduction | Sumit Patel, Bosheng Sun, Brent McDonald |
| Time | Location | Session Title | Speaker(s) |
|---|---|---|---|
| 08:30 - 08:50 | Technical Lecture - T02.1/214B | A Novel Control Method to Improve Totem-Pole Bridgeless PFC Efficiency | Bosheng Sun, Sheng-Yang Yu, PhD |
| 08:30 - 08:55 | Industry Session - IS05.1/210 | Methods to Control Bootstrap Overcharge in Half-bridge Gate Driver ICs | Alex Mazany |
| 08:55 - 09:20 | Industry Session - IS05.2/210 | Gate Driver Features and Considerations for Bidirectional FETs in Single-stage Matrix Converters | Alex Mazany |
| 10:40 - 11:05 | Industry Session - IS06.5/207 | Powering AI Chips: Your Last Innovation | Sombuddha Chakraborty |
| 11:40 - 12:00 | Technical Lecture - T01.9/214A | Reverse Control of the phase-Shifted Full Bridge Converter for Minimum Voltage Stress | Wei Gao, Jiawen Fu, Yupi Ji |
| 13:30 - 14:00 | Exhibitor Presentations - Expo Theater 1 | Reimagining Data Center Power Architecture | Pradeep Shenoy, PhD |
Advancing power innovation with TI's packaging technology
TI's isolated power modules with proprietary IsoShield™ packaging technology are helping engineers pack more power into increasingly small spaces. These chips deliver up to three times higher power density to enable more advanced, efficient and reliable data centers and EVs.
Transform the power path from grid to gate
Build next-generation data centers that support 800V power architectures with unprecedented power density and efficiency
With products and designs that optimize power delivery for AI data centers from grid to gate, our technologies enable the massive computational power demands of tomorrow's AI workloads while maximizing energy efficiency.
Meet with our engineers to learn more about how we can help accelerate your data center design development.
Accelerate the electrification evolution
Design electric vehicles that are safer, charge faster and drive further
At TI, we are innovating across hybrid electric vehicle and electric vehicle applications, from our single-stage matrix converters for onboard chargers to our electrochemical impedance spectroscopy (EIS) technology for battery management systems and our real-time motor control solutions for traction inverters.
Join our engineers to learn more about the latest advancements in vehicle electrification, 48V, and USB Type-C® and USB Power Delivery (PD) charger reference designs.
Power the future of energy and intelligent machines
Design next-generation industrial systems that deliver higher efficiency, power density and real-time control
From sustainable energy conversion and storage to precision humanoid robotics, our technologies enable efficient energy flow, fast dynamic response and coordinated motion – helping engineers build a cleaner energy infrastructure and more capable automation for the real world.
Come by the TI booth to see our latest demos for solid-state transformer systems, humanoid applications and more.