SMT & packaging application notes
17 Mar 2026
Find documentation on TI’s surface mount technology (SMT) and application notes on a variety of packaging-related topics.
DSBGA
QFN
- Leadless Leadframe Package (LLP) Application Note
- Quad Flatpack No-Lead Logic Packages
- 56Pin Quad Flatpack No-Lead Logic Package
- Design Guide 92NLA Array QFN
- Design Summary Multi-row Quad Flat No-lead (MRQFN)
- Micro SMDxt Wafer Level Chip Scale Package (large)
- QFN/SON PCB Attachment Application
- Reworking LLP Chip Scale Package
- Soldering requirements for BQFN
- Surface Mount Package Removal
- The Impact of Lead Overhang on SMT for QFN Packages
BGA
- 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide
- 32 Bit Logic Familes in LFBGA Packages
- BGA Application Report for SMT
- Flip Chip BGA Package Reference
- nFBGA Packaging
- Plastic Ball Grid Array SMT Guideline
- Bumped Die Package
- PCB design guidelines for 0.4mm POP (Part 1)
- PCB design guidelines for 0.4mm POP (Part 2)
- TI OMAP POP SMT design guideline
- MicroStar BGA Packaging Reference Guide
Leaded packages
Image, thermal & electrical packages
- Recent Advancements in Bus-Interface Packing and Processing
- K-Factor Test-Board Design Impact on Thermal Impedance Measurements
- Package Thermal Characterization Methodologies
- Thermal Calculation Tools for Analog Components
- Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs
- Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices
- TMS320C6x Thermal Design Considerations
- Thermal Calculator Application Note
- IC Package Thermal Metrics
- A Guide to Board Layout for Best Thermal Resistance for Exposed Packages
- Understanding IC Package Power Capabilities
- Thermal Reference Sheet Analog
- How to Use a PowerPad Device
- How to use Psi-JT to calculate Junction Temperature
- Using Thermal Metrics for Power Devices
Other packages
General packaging information
- Semiconductor Packaging Assembly Technology
- Absolute Maximum Ratings for Soldering
- Wave Solder Exposure of SMT Package
- External Lead Finish for Plastic Packages
- Handling & Process Recommendations
- Plastic Package Moisture-Induced Cracking
- Pb-free and Pb Compatibility
- Electrical Performance of Packages
- EcoShip and EnviroPack: The Sustainable Solution for Storage and Shipping