Smart and efficient power conversion for your processor core. Harnessing our expertise and industry leadership in multiphase solutions for CPU cores, we create high-density, energy-efficient core power solutions tailored to needs of AI-driven high computing. Pair our smart monitoring power stages or modules with our super fast transient controllers for a streamlined DC/DC power supply. With our diverse portfolio of power devices and multiphase controllers, we empower power-supply design of your CPUs, GPUs, SoCs, or Custom ASICs and FPGAs for use in enterprise servers, datacenters, networking and communications.
Browse by category
Controllers
Supporting Intel SVID, AMD SVI, AVSBus, and PMBus protocols via an intuitive GUI. Scable, stackable and current sharing for high current capability with fast transient response.
Power stages
Available across many current ranges in lead-free packages for diverse processor needs. Integrated drivers for telemetry, protection features and a trans-inductance voltage regulator reduce BOM costs.
Related resources
Power for embedded systems
TI has power-supply solutions for your systems on a chip (SoCs), processors, microcontrollers, sensors or field-programmable gate arrays (FPGAs).
Why choose our multiphase core power solutions?
High efficiency and power density
Field-effect transistor and package innovations, including integrated drivers in the thermal-enhanced flip-chip HotRod™ package, enable efficiency and power density, with peak currents as high as 90A.
Accurate telemetry and advanced features
With 3% accuracy over temperatures as low as 2°C, our multiphase solutions have an enhanced trans-inductance voltage regulator (TLVR) and current sharing for stackability in high power applications.
Flexibility, scalability and a fast transient response
Our multiphase controllers are designed with a D-CAP+™ control loop that enables a faster response to rising and falling transients, providing design flexibility with scalable phase and loop counts.
Built for reliability
Advanced fault reporting and protection against overcurrent, overvoltage and overtemperature increase reliability. Accelerated lifetime testing qualification ensures sustainability.
Engineering high-performance, reliable and efficient multiphase core solutions
Enhanced nonlinear control and flexibility for asymmetrical board designs
Our D-CAP+™ control architecture enables a fast load transient response, increasing efficiency in your power designs.
Benefits:
- Constant on-time adapts to the input and output voltages.
- Fast and accurate response enables dynamic current sharing.
- A combination of averaged phase currents and compensation voltage regulates the feedback voltage for the compensation loop.
- Natural phase interleaving and constant current balancing between phases.
- True current-mode control as the output inductance does not affect voltage-loop stability.
Reference design
Flexible power reference design for high performance Xilinx and Intel FPGA platforms
This reference design addresses the increase in power requirements per rail for field-programmable gate arrays (FPGAs) with our power management integrated circuits (PMICs) and controller solutions.
Application note
D-CAP+™ Control for Multiphase Step-Down Voltage Regulators for Powering Microp
This application report introduces the basics of three generations of D-CAP+™ multiphase step-down controllers.
Package optimization for enhanced electrical and thermal performance
Our smart power stages and power modules in PowerStack™ and HotRod™ packages can replace the traditional bond-wire quad flat no-lead package and stacking using large metal chips.
Benefits:
- Reduced parasitic loop inductance for faster switching and improved efficiency.
- Improved thermal performance, especially when using the large die attach pad on center pad.
Package optimization – HotRod™ QFN and enhanced HotRod™ QFN
HotRod, or flip-chip on leadframe QFN packages, eliminate the need for bondwires. See how you can use our HotRod package technology in an appropriate layout to mitigate EMI issues, while reducing your solution size.
Video
PowerStack™ packaging technology overview
A deeper look into the construction of TI’s smart power stages and how packaging can enhance circuit performance.
Intelligent drivers for advanced telemetry and protection for a simplified and reliable design
Our NexFET™ technology power stage in our flip-chip HotRod™ package provides optimized efficiency and power density. Our power stages are also integrated with an intelligent driver circuit.
Benefits:
- Cycle-by-cycle temperature-compensated bidirectional current sensing ensures up to 2.5% accuracy at ambient temperatures and 3% in overtemperature conditions.
- Temperature monitoring of resolutions ±2°C.
- Cycle-by-cycle overcurrent limiting, negative overcurrent, high-side short-circuit and overtemperature detection.
- Enhanced handshake and fault diagnostics when paired with certain TI controllers.
Technical Resources
An introduction to multiphase buck regulators
In this video we discuss what a multi-phase buck regulator is exactly, what applications they're suited for, and some of the challenges associated with implementing them.
Technical article
An introduction to the D-CAP+™ modulator and its real world performance
An introduction to the D-CAP+™ modulator and its real world performance
Application note
Power loss calculation with CSI consideration for synchronous buck converters (Rev. A)
Power loss calculation with common source inductance consideration for synchronous buck converters
Discover featured applications
Server CPU or Motherboard
Shrink overall solution size, improve transient response and output voltage ripple, optimize efficiency, and strengthen system protection with our multiphase DC/DC power conversions solutions.
Shrink overall solution size, improve transient response and output voltage ripple, optimize efficiency, and strengthen system protection with our multiphase DC/DC power conversions solutions.
Benefits:
- PowerStack™ packaging technology eliminates parasitics, while a large ground leadframe provides excellent thermal performance.
- Cycle-by-cycle accurate temperature-compensated bidirectional current sensing improves system monitoring.
- Advanced fault monitoring improves system reliability.
- Integrated MOSFETs, smart drivers and current sensors provide switching functionality that removes passive components, simplifying printed circuit board layout.
- D-CAP+™ technology on our dual phase controllers enhances nonlinear control, provides flexibility for asymmetrical board designs.
Featured resources
END-EQUIPMENT / SUB-SYSTEM
PRODUCTS
- CSD95410RRB – 90-A peak continuous synchronous buck NexFET™ smart power stage
- CSD95420RCB – 50-A peak continuous synchronous buck NexFET™ smart power stage
- CSD95411 – 65-A peak continuous current synchronous buck NexFET™ power stage
Wired networking: NIC, Switches, Routers
Enable power solutions beyond 1,000A for network switches, routers and smart NIC application with fast transient response, optimize efficiency and strengthen system protection.
Enable power solutions beyond 1,000A for network switches, routers and smart NIC application with fast transient response, optimize efficiency and strengthen system protection.
Our high current smart power stages with active sharing feature for stackability enables higher power requirements.
Benefits:
- Active current-sharing phase-doubling power-stage technology ensures accurate current sharing among stacked power stages.
- PowerStack™ packaging technology eliminates parasitics, while a large ground leadframe provides excellent thermal performance.
- D-CAP+™ technology on our dual phase controllers enhances nonlinear control, provides flexibility for asymmetrical board designs.
Featured resources
END-EQUIPMENT / SUB-SYSTEM
PRODUCTS
- CSD95430 – 90-A peak continuous-current synchronous-buck NexFET™ smart power stage
- CSD95410RRB – 90-A peak continuous synchronous buck NexFET™ smart power stage
- CSD95420RCB – 50-A peak continuous synchronous buck NexFET™ smart power stage
Data Center AI Accelerator
Compact higher DC/DC power solution for AI hardware accelerator and graphical processing units (GPUs) with fast transient response, maximum efficiency and advanced system protection.
Compact higher DC/DC power solution for AI hardware accelerator and graphical processing units (GPUs) with fast transient response, maximum efficiency and advanced system protection.
Our flexible, scalable controllers include high-current smart power stages and fast transient controllers.
Benefits:
- 25V field-effect transistor technology enables input voltage ranges as high as 16V.
- Cycle-by-cycle temperature-compensated bidirectional current sensing improves system monitoring.
- Advanced fault monitoring improves system reliability.
- Integrated MOSFETs, smart drivers and current sensors provide switching functionality that removes passive components, simplifying printed circuit board layouts.
Featured resources
END-EQUIPMENT / SUB-SYSTEM
PRODUCTS
- CSD96415 – 80-A peak continuous current synchronous buck NexFET™ power stage
- CSD96416 – 50-A peak continuous current synchronous buck NexFET™ smart power stage
- CSD95410RRB – 90-A peak continuous synchronous buck NexFET™ smart power stage
Design & development resources
Evaluation board
Dual-channel (6+2/5+3) evaluation module for D-CAP+™ step-down controller with PMBus interface
The TPS53681EVM evaluation module allows users to assess the operating characteristics of the TPS53681 controller with the CSD95490 smart power stages in a low voltage, high current, step-down point of load (POL) application with the configuration, control and monitoring functionality of the (...)
Evaluation board
TPSM831D31, 8V to 14V Input, Dual Output, 120A + 40A PMBus Power Module Evaluation Module
The TPSM831D31 evaluation board is configured to evaluate the operation of the TPSM831D31 power module for current up to 120 A for output A and 40 A for output B. The input voltage range is 8 V to 14 V. The output voltage range for both output A and output B is 0.25 V to 1.52 V. The evaluation (...)
Evaluation board
Dual-channel (12+0, 11+1 or 10+2 phases), D-CAP+ step-down, DC-DC analog with PMBus interface EVM
The TPS536C7EVM evaluation module (EVM) allows users to evaluate the TPS536C7 controller.
The controller is dual-channel (12 + 0, 11 + 1 or 10 + 2 phases), D-CAP+™ synchronous buck driverless control with PMBus Interface. The device operates using a voltage supply between 4.5 V and 17 V. The (...)
Read our blog
25 OCT 2022 | COMPANY BLOG
How thermal efficiency is helping data centers run more sustainably
Innovative semiconductor design and packaging technologies are improving efficiencies in data centers as server power demands increase