CSD96416

ACTIVE

50-A peak continuous current synchronous buck NexFET™ smart power stage

Product details

VDS (V) 25 Ploss current (A) 25
VDS (V) 25 Ploss current (A) 25
VQFN-CLIP (RWJ) 41 30 mm² 6 x 5
  • Peak current rating: 50 A
  • 16-V VIN, 25-V high-side and low-side FET
  • Adjusted deadtime trim to improve transient response with non-TI controller
  • Peak efficiency (fSW = 600 kHz, LOUT = 150 nH): over 94%
  • High-frequency operation (up to 1.75 MHz)
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead-time for shoot-through protection
  • High-density, QFN 5-mm × 6-mm footprint
  • Ultra-low-inductance package
  • System optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant, lead-free terminal plating
  • Halogen free
  • Peak current rating: 50 A
  • 16-V VIN, 25-V high-side and low-side FET
  • Adjusted deadtime trim to improve transient response with non-TI controller
  • Peak efficiency (fSW = 600 kHz, LOUT = 150 nH): over 94%
  • High-frequency operation (up to 1.75 MHz)
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead-time for shoot-through protection
  • High-density, QFN 5-mm × 6-mm footprint
  • Ultra-low-inductance package
  • System optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant, lead-free terminal plating
  • Halogen free

The CSD96416 NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm package. This power stage has an adjusted deadtime trim to improve transient response with non-TI controller. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD96416 NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm package. This power stage has an adjusted deadtime trim to improve transient response with non-TI controller. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

Download View video with transcript Video
 

Request more information

The full data sheet and other information are available. Request now

Similar products you might be interested in

open-in-new Compare alternates
Pin-for-pin with same functionality to the compared device
CSD96415 ACTIVE 80-A peak continuous current synchronous buck NexFET™ power stage Same common footprint, higher current, higher efficiency 80-A power stage

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet CSD96416 Synchronous Buck NexFET™ Smart Power Stage datasheet PDF | HTML 20 Dec 2022

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins Download
VQFN-CLIP (RWJ) 41 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos