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Power density

Power density

Achieve more power in smaller spaces, enhancing system functionality at reduced system costs

Pushing power density further

What technologies are enabling greater density?

Board area and height are becoming limiting factors as power demands increase. Power designers must squeeze more circuitry into their applications to differentiate their products while also increasing efficiency and enhancing thermal performance. Higher power levels in smaller form factors are now possible using TI’s advanced process, packaging and circuit-design technologies.

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Benefits of TI technologies for power density

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Smaller footprint, less heat

Save board space with high-performance device options that pair unique integration techniques and ultra-low RDSON, low-RSP FETs for smaller die sizes.

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Improved thermal performance

Remove heat from the package with advanced cooling technologies, including enhanced HotRod™ QFN packaging, power wafer chip-scale packaging (WCSP) and top-side cooling.

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Increased efficiency

Use smaller passives while switching at higher frequencies – without sacrificing efficiency – with multilevel converter topologies and advanced power-stage gate drivers.

Learn more about how we enable improved power density

Video series

Breaking down the fundamentals of power density

Every new technology advancement demands more power in smaller spaces. That’s the promise of power density – smaller packages, higher current, fewer trade-offs. See how we're driving greater density for the years to come.

Watch the video series
White paper
Understanding the trade-offs and technologies to increase power density (Rev. C)
Space is limited in power-supply designs, and engineers face constant pressure to do more with less. In this paper, we examine the barriers limiting designers in depth and provide technology examples to help you overcome them.
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Technical article
Managing thermals: 3 ways to break through power-density barriers
From circuit design to thermally optimized system designs and more, TI is your partner in solving power density challenges. Learn more about our multi-faceted approach to making smaller, higher performance ICs a reality.
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Reference design
GaN-based, 6.6-kW, bidirectional, onboard charger reference design
The PMP22650 reference design is a 6.6-kW, bidirectional, onboard charger. The design employs a two-phase totem pole PFC and a full-bridge CLLLC converter with synchronous rectification. The CLLLC utilizes both frequency and phase modulation to regulate the output across the required regulation (...)
Reference design
High-power, high-performance automotive SiC traction inverter reference design

TIDM-02014 is a 800-V, 300kW SiC-based traction inverter system reference design developed by Texas Instruments and Wolfspeed provides a foundation for OEMs and design engineers to create high-performance, high-efficiency traction inverter systems and get to market faster. This solution (...)

Reference design
Variable-frequency, ZVS, 5-kW, GaN-based, two-phase totem-pole PFC reference design
This reference design is a high-density and high-efficiency 5-kW totem-pole power factor correction (PFC) design. The design uses a two-phase totem-pole PFC operating with variable frequency and zero voltage switching (ZVS). The control uses a new topology and improved triangular current mode (...)