OMAP5912ZVLR

ACTIVE

Applications processor | ZVL | 289 | -40 to 85

ACTIVE Custom reel may be available
Same as: OMAP5912ZVLR.A This part number is identical to the part number listed above. You can only order quantities of the part number listed above.
  • Inventory:
    Limit: This limit is in place to protect sample purchases for design evaluation and will be removed once more stock is available.
Out of stock
Not available

Pricing

Qty Price
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—
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Additional package qty | Carrier options These products are exactly the same but come in a different carrier type

OMAP5912ZVL ACTIVE
Package qty | Carrier 160 | JEDEC TRAY (10+1)
Inventory
Out of stock
Not available
Qty | Price 1ku | — — — +
Limit: This limit is in place to protect sample purchases for design evaluation and will be removed once more stock is available.
Out of stock
Not available

Quality information

Rating Catalog
RoHS Yes
REACH Yes
Lead finish / Ball material SnAgCu
MSL rating / Peak reflow Level-3-260C-168 HR
Quality, reliability
& packaging information

Information included:

  • RoHS
  • REACH
  • Device marking
  • Lead finish / Ball material
  • MSL rating / Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
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Additional manufacturing information

Information included:

  • Fab location
  • Assembly location
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Export classification

*For reference only

  • US ECCN: 5A992C

Packaging information

Package | Pins NFBGA (ZVL) | 289
Operating temperature range (°C) -40 to 85
Package qty | Carrier 1,000 | LARGE T&R

Features for the OMAP5912

  • Low-Power, High-Performance CMOS Technology
    • 0.13-µm Technology
    • 192-MHz Maximum Frequency
    • 1.6 ± 5% V Core Voltage
  • ARM926EJ-S™ (MPU) Core
    • Support for 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
    • 16K-Byte Instruction Cache
    • 8K-Byte Data Cache
    • Data and Program Memory Management Unit (MMU)
    • 17-Word Write Buffer
    • Two 64-Entry Translation Look-Aside Buffers (TLBs) for MMUs
  • TMS320C55x™ (C55x™) DSP Core
    • One/Two Instructions Executed per Cycle
    • Dual Multipliers (Two Multiply-Accumulates per Cycle)
    • Two Arithmetic/Logic Units
    • Five Internal Data/Operand Buses (3 Read Buses and 2 Write Buses)
    • 32K x 16-Bit On-Chip Dual-Access RAM (DARAM) (64K Bytes)
    • 48K x 16-Bit On-Chip Single-Access RAM (SARAM) (96K Bytes)
    • Instruction Cache (24K Bytes)
    • Video Hardware Accelerators for DCT, iDCT, Pixel Interpolation, and Motion Estimation for Video Compression
  • 250K Bytes of Shared Internal SRAM
  • Memory Traffic Controller (TC)
    • 16-Bit EMIFS Supports up to 256M Bytes of External Memory (i.e., Async. ROM/RAM, NOR/NAND Flash, and Sync. Burst Flash)
    • 16-Bit EMIFF to Access up to 64M Bytes of SDRAM, Mobile SDRAM, or Mobile DDR
  • DSP Memory Management Unit
  • DSP Peripherals
    • Three 32-Bit Timers and Watchdog Timer
    • Six-Channel DMA Controller
    • Two Multichannel Buffered Serial Ports
    • Two Multichannel Serial Interfaces
  • MPU Peripherals
    • Three 32-Bit Timers and Watchdog Timer
    • USB 1.1 Host and Client Controllers
    • USB On-the-Go (OTG) Controller
    • 3 USB Ports, One With an Integrated Transceiver
    • Camera Interface for Parallel CMOS Sensors
    • Real-Time Clock (RTC)
    • Pulse-Width Tone (PWT) Interface
    • Pulse-Width Light (PWL) Interface
    • Keyboard Matrix Interface (6 x 5 or 8 x 8)
    • HDQ/1-Wire® Interface
    • Multimedia Card (MMC) and Secure Digital (SD) Interface
    • Up to 16 MPU General-Purpose I/Os
    • Two LED Pulse Generators (LPGs)
    • ETM9™ Trace Module for ARM926EJ-S Debug
    • 16-/18-Bit LCD Controller With Dedicated System DMA Channel
    • 32-kHz Operating System (OS) Timer
  • Shared Peripherals
    • 8 General-Purpose Timers
    • Serial Port Interface (SPI)
    • Three Universal Asynchronous Receiver/Transmitters (UARTs) (Two Supporting SIR mode for IrDA)
    • Inter-Integrated Circuit (I2C) Master and Slave Interface
    • Multimedia Card (MMC) and Secure Digital (SD) Interface
    • Multichannel Buffered Serial Port
    • Up to 64 Shared General-Purpose I/Os
    • 32-kHz Synchro Counter
  • Endian Conversion Unit
  • Hardware Accelerators for Cryptographic Functions
    • Random Number Generation
    • DES and 3DES
    • SHA-1 and MD5
  • Individual Power-Saving Modes for MPU/DSP/TC
  • On-Chip Scan-Based Emulation Logic
  • IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • Three 289-Ball BGA (Ball Grid Array) Packages (ZDY and ZZG - Lead-Free; GDY - With Lead)
  • The OMAP5912 device is targeted at the following applications:
    • Applications Processing Devices
    • Mobile Communications
      • WAN 802.11X
      • Bluetooth™
      • GSM, GPRS, EDGE
      • CDMA
    • Video and Image Processing (MPEG4, JPEG, Windows® Media Video, etc.)
    • Advanced Speech Applications (text-to-speech, speech recognition)
    • Audio Processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and Other GSM Speech Codecs)
    • Graphics and Video Acceleration
    • Generalized Web Access
    • Data Processing

IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary Scan Architecture.


TMS320C55x, C55x, OMAP, and DSP/BIOS are trademarks of Texas Instruments.
ARM926EJ-S and ETM9 are trademarks of ARM Limited in the EU and other countries.
Thumb and ARM are registered trademarks of ARM Limited in the EU and other countries.
1-Wire is a registered trademark of Dallas Semiconductor Corporation.
Bluetooth is a trademark owned by Bluetooth SIG, Inc.
Windows is a registered trademark of Microsoft Corporation in the United States and/or other countries.

Description for the OMAP5912

OMAP5912 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.

The OMAP™ platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture provides benefits of both DSP and reduced instruction set computer (RISC)technologies, incorporating a TMS320C55x DSP core and a high-performance ARM926EJ-S ARM® core.

  • Inventory:
    Limit: This limit is in place to protect sample purchases for design evaluation and will be removed once more stock is available.
Out of stock
Not available

Pricing

Qty Price
—
—
—
+

Additional package qty | Carrier options These products are exactly the same but come in a different carrier type

OMAP5912ZVL ACTIVE
Package qty | Carrier 160 | JEDEC TRAY (10+1)
Inventory
Out of stock
Not available
Qty | Price 1ku | — — — +
Limit: This limit is in place to protect sample purchases for design evaluation and will be removed once more stock is available.
Out of stock
Not available

Carrier options

You can choose different carrier options based on the quantity of parts, including full reel, custom reel, cut tape, tube or tray.

A custom reel is a continuous length of cut tape from one reel to maintain lot- and date-code traceability, built to the exact quantity requested. Following industry standards, a brass shim connects an 18-inch leader and trailer on both sides of the cut tape for direct feeding into automated assembly machines. TI includes a reeling fee for custom reel orders.

Cut tape is a length of tape cut from a reel. TI may fulfill orders using multiple strips of cut tapes or boxes to satisfy the quantity requested.

TI often ships tube or tray devices inside a box or in the tube or tray, depending on inventory availability. We pack all tapes, tubes or sample boxes according to internal electrostatic discharge and moisture-sensitivity-level protection requirements.

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Lot and date code selection may be available

Add a quantity to your cart and begin the checkout process to view the options available to select lot or date codes from existing inventory.

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