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SN74CBT3306

ACTIVE
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5-V, 1:1 (SPST), 2-channel general-purpose FET bus switch

Data sheet
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SN74CBT3306C ACTIVE 5-V, 1:1 (SPST), 2-channel FET bus switch with –2-V undershoot protection (active low) Upgraded powered-off protection and undershoot protection support
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5-V, 1:1 (SPST), 2-channel general-purpose FET bus switch

SN74CBT3306

ACTIVE
Data sheet Order now

Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 2 Power supply voltage - single (V) 5 Ron (Typ) (Ohms) 5 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (C) -40 to 85 Features Supports I2C signals Input/output continuous current (Max) (mA) 128 Rating Catalog open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOIC (D) 8 19 mm² 3.91 x 4.9 TSSOP (PW) 8 19 mm² 3 x 6.4 open-in-new Find other Analog switches & muxes

Features

  • 5- Switch Connection Between Two Ports
  • TTL-Compatible Input Levels
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Description

The SN74CBT3306 dual FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE\) input is high.

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Technical documentation

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Type Title Date
* Datasheet SN74CBT3306 datasheet (Rev. H) Jan. 15, 2004
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Digital Bus Switch Selection Guide (Rev. A) Nov. 10, 2004
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
More literature I2C and Serial Bus Devices Application Clip Jul. 10, 2003
More literature CBT RAID Application Clip Jun. 12, 2003
Application note Bus FET Switch Solutions for Live Insertion Applications Feb. 07, 2003
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application note Flexible Voltage-Level Translation With CBT Family Devices Jul. 20, 1999
User guide CBT (5-V) And CBTLV (3.3-V) Bus Switches Data Book (Rev. B) Dec. 01, 1998
Application note 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A) Apr. 03, 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note 5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B) Mar. 01, 1997
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
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INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


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CAD/CAE symbols

Package Pins Download
SOIC (D) 8 View options
TSSOP (PW) 8 View options

Ordering & quality

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  • Ongoing reliability monitoring

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