Single Wide Bandwidth High Output Drive Single Supply Op Amp With Shutdown
Product details
Parameters
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Features
- Wide Bandwidth: 10 MHz
- High Output Drive:
- IOH: 57 mA at VDD – 1.5 V
- IOL: 55 mA at 0.5 V
- High Slew Rate:
- SR+: 16 V/µs
- SR–: 19 V/µs
- Wide Supply Range: 4.5 V to 16 V
- Supply Current: 1.9 mA/Channel
- Ultralow Power Shutdown Mode:
- IDD: 125 µA/Channel
- Low Input Noise Voltage: 8.5 nV√Hz
- Input Offset Voltage: 60 µV
- Ultra-Small Packages:
- 8- or 10-Pin MSOP (TLC080/1/2/3)
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
Description
The first members of TI’s new BiMOS general-purpose operational amplifier family are the TLC08x. The BiMOS family concept is simple: provide an upgrade path for BiFET users who are moving away from dual-supply to single-supply systems and demand higher ac and dc performance. With performance rated from 4.5 V to 16 V across commercial (0°C to 70°C) and an extended industrial temperature range (–40°C to 125°C), BiMOS suits a wide range of audio, automotive, industrial, and instrumentation applications. Familiar features like offset nulling pins, and new features like MSOP PowerPAD™ packages and shutdown modes, enable higher levels of performance in a variety of applications.
Developed in TI’s patented LBC3 BiCMOS process, the new BiMOS amplifiers combine a very high input impedance, low-noise CMOS front end with a high-drive bipolar output stage, thus providing the optimum performance features of both. AC performance improvements over the TL08x BiFET predecessors include a bandwidth of 10 MHz (an increase of 300%) and voltage noise of 8.5 nV/√Hz (an improvement of 60%). DC improvements include an ensured VICR that includes ground, a factor of 4 reduction in input offset voltage down to 1.5 mV (maximum) in the standard grade, and a power supply rejection improvement of greater than 40 dB to 130 dB. Added to this list of impressive features is the ability to drive ±50-mA loads comfortably from an ultrasmall-footprint MSOP PowerPAD package, which positions the TLC08x as the ideal high-performance general-purpose operational amplifier family.
For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web site at www.ti.com.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | TLC080 - Family of Wide-Bandwidth High-Output-Drive Single Supply Op Amps datasheet (Rev. F) | Dec. 07, 2011 |
| Technical articles | What is an op amp? | Jan. 21, 2020 | |
| Technical articles | Designing tiny microphone circuits with the industry’s smallest op amp | Apr. 12, 2018 | |
| Technical articles | How to lay out a PCB for high-performance, low-side current-sensing designs | Feb. 06, 2018 | |
| Technical articles | Low-side current sensing for high-performance cost-sensitive applications | Jan. 22, 2018 | |
| White papers | The Signal e-book: A compendium of blog posts on op amp design topics | Mar. 28, 2017 | |
| Application notes | TLC08x and TLC08xA EMI Immunity Performance | Aug. 19, 2013 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The TI Precision Amplifier Quickstart Kit simplifies op amp selection, design, and evaluation with samples of six op amps and an evaluation module for prototyping surface-mount ICs. The kit is the perfect starting point for your amplifier designs.
You may also be interested in TI Precision Labs, the (...)
Features
The kit includes:
- Six samples: Three low-power, low-voltage amplifiers and three low-power, wide-supply amplifiers. See the table below for the complete list.
- DIP Adapter Evaluation Module (DIP-ADAPTER-EVM) for prototyping surface-mount ICs. The EVM supports the following package types: D or U (...)
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
The Universal OPAMPEVM is a series of general purpose blank circuit boards that simplify prototyping circuits for a variety of IC package types. The evaluation module board design allows many different circuits to be constructed easily and quickly. Five models are offered with each targeted for (...)
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Features
- Expedites circuit design with analog-to-digital converters (ADCs) and digital-to-analog converters (DACs)
- Noise calculations
- Common unit translation
- Solves common amplifier circuit design problems
- Gain selections using standard resistors
- Filter configurations
- Total noise for common amplifier configurations
- (...)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| PDIP (P) | 8 | View options |
| SOIC (D) | 8 | View options |
Ordering & quality
Support & training
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