TLV170 36V, 1.2 MHz, microPower, Rail-to-Rail Output, General Purpose Op Amp | TI.com

TLV170
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36V, 1.2 MHz, microPower, Rail-to-Rail Output, General Purpose Op Amp

 

Description

The TLVx170 family of electromagnetic interference (EMI)-hardened, 36-V, single-supply, low-noise operational amplifiers (op amps) have a THD+N of 0.0002% at 1 kHz and can operate on supplies that range from 2.7 V (±1.35 V) to 36 V (±18V). These features, along with low noise and very high power-supply rejection ratio (PSRR), make the single-channel TLV170, dual-channel TLV2170, and quad-channel TLV4170 suitable for use in microvolt-level signal amplification. The TLVx170 family of devices also gives good offset, drift, and bandwidth with low quiescent current.

Unlike most op amps that are specified at only one supply voltage, the TLVx170 family of op amps is specified from 2.7 V to 36 V with the ability to swing input signals beyond the supply rails without phase reversal. The TLVx170 family is also unity-gain stable with a 200-pF capacitive load with a 1.2-MHz bandwidth and a 0.4-V/µs slew rate for use in current-to-voltage converters.

The device inputs can operate 100 mV below the negative rail and within 2 V of the positive rail for normal operation, and with full rail-to-rail input with reduced performance. The TLVx170 devices are specified from –40°C to +125°C.

Features

  • Supply Range: 2.7 V to 36 V, ±1.35 V to ±18 V
  • Low Noise: 22 nV/√Hz
  • EMI-Hardened with RFI-Filtered Inputs
  • Input Range Includes the Negative Supply
  • Unity-Gain Stable: 200-pF Capacitive Load
  • Rail-to-Rail Output
  • Gain Bandwidth: 1.2 MHz
  • Low Quiescent Current: 125 µA per Amplifier
  • High Common-Mode Rejection: 110 dB
  • Low Bias Current: 10 pA (typical)

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Parametrics

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Part number Order Number of channels (#) Total supply voltage (Min) (+5V=5, +/-5V=10) Total supply voltage (Max) (+5V=5, +/-5V=10) GBW (Typ) (MHz) Slew rate (Typ) (V/us) Rail-to-rail Vos (offset voltage @ 25 C) (Max) (mV) Iq per channel (Typ) (mA) Vn at 1 kHz (Typ) (nV/rtHz) Rating Operating temperature range (C) Package Group Package size: mm2:W x L (PKG) Offset drift (Typ) (uV/C) Features CMRR (Typ) (dB) Output current (Typ) (mA) Architecture
TLV170 Order now 1     2.7     36     1.2     0.4     In to V-
Out    
2.5     0.125     22     Catalog     -40 to 125     SOIC | 8
SOT-23 | 5    
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
5SOT-23: 5 mm2: 1.6 x 2.9 (SOT-23 | 5)    
2     Cost Optimized
EMI Hardened    
110     17     CMOS    
TLV2170 Order now 2     2.7     36     1.2     0.4     In to V-
Out    
2.5     0.125     22     Catalog     -40 to 125     SOIC | 8
VSSOP | 8    
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8)    
2     Cost Optimized
EMI Hardened    
110     17     CMOS    
TLV4170 Order now 4     2.7     36     1.2     0.4     In to V-
Out    
2.5     0.125     22     Catalog     -40 to 125     SOIC | 14
TSSOP | 14    
14SOIC: 52 mm2: 6 x 8.65 (SOIC | 14)
14TSSOP: 32 mm2: 6.4 x 5 (TSSOP | 14)    
2     Cost Optimized
EMI Hardened    
110     17     CMOS