Single 2.8MHz, improved offset, 600uA/ch RRIO op amp
Product details
Parameters
Package | Pins | Size
Features
- CMOS Rail-To-Rail Input/Output
- Input Bias Current: 2.5pA
- Low Supply Current: 600µA/Channel
- Ultra-Low Power Shutdown Mode:
- IDD(SHDN): 350nA/ch at 3V
- IDD(SHDN): 1000nA/ch at 5V
- Gain-Bandwidth Product: 2.8MHz
- High Output Drive Capability:
- ±10mA at 180mV
- ±35mA at 500mV
- Input Offset Voltage: 250µV (typ)
- Supply Voltage Range: 2.7V to 6V
- Ultra-Small Packaging
- SOT23-5 or -6 (TLV2470/1)
- MSOP-8 or -10 (TLV2472/3)
PowerPAD is a trademark of Texas Instruments.
Microsim PARTS is a trademark of MicroSim Corporation.
Microsim PSpice is a registered trademark of MicroSim Corporation.
All other trademarks are the property of their respective owners.
Description
The TLV247x is a family of CMOS rail-to-rail input/ output operational amplifiers that establishes a new performance point for supply current versus ac performance. These devices consume just 600µA/channel while offering 2.8MHz of gain-bandwidth product. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower operational amplifiers. The TLV247x can swing to within 180mV of each supply rail while driving a 10mA load. For non-RRO applications, the TLV247x can supply ±35mA at 500mV off the rail. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV247x family ideal for sensor interface, portable medical equipment, and other data acquisition circuits.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | Family of 600uA/Ch 2.8MHz Rail-to-Rail I/O High-Drive Op Amps with Shutdown datasheet (Rev. E) | Jul. 03, 2007 |
| Technical articles | What is an op amp? | Jan. 21, 2020 | |
| Technical articles | Designing tiny microphone circuits with the industry’s smallest op amp | Apr. 12, 2018 | |
| Technical articles | How to lay out a PCB for high-performance, low-side current-sensing designs | Feb. 06, 2018 | |
| Technical articles | Low-side current sensing for high-performance cost-sensitive applications | Jan. 22, 2018 | |
| White papers | The Signal e-book: A compendium of blog posts on op amp design topics | Mar. 28, 2017 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The TI Precision Amplifier Quickstart Kit simplifies op amp selection, design, and evaluation with samples of six op amps and an evaluation module for prototyping surface-mount ICs. The kit is the perfect starting point for your amplifier designs.
You may also be interested in TI Precision Labs, the (...)
Features
The kit includes:
- Six samples: Three low-power, low-voltage amplifiers and three low-power, wide-supply amplifiers. See the table below for the complete list.
- DIP Adapter Evaluation Module (DIP-ADAPTER-EVM) for prototyping surface-mount ICs. The EVM supports the following package types: D or U (...)
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
Features
- 3 packages to choose from: SC70-5, SOT23-5 and SOIC-8
- 12 circuit configurations to choose from: Noninverting, Inverting, Active Filters, Difference Amp, Comparator and more!
- Dual and single supply configurations
- PCB designed for High performance: Optimized for each function
- Multiple interface options (...)
Description
The Universal OPAMPEVM is a series of general purpose blank circuit boards that simplify prototyping circuits for a variety of IC package types. The evaluation module board design allows many different circuits to be constructed easily and quickly. Five models are offered with each targeted for (...)
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Features
- Expedites circuit design with analog-to-digital converters (ADCs) and digital-to-analog converters (DACs)
- Noise calculations
- Common unit translation
- Solves common amplifier circuit design problems
- Gain selections using standard resistors
- Filter configurations
- Total noise for common amplifier configurations
- (...)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| PDIP (P) | 8 | View options |
| SOIC (D) | 8 | View options |
Ordering & quality
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.