| Top documentation | Type | Title | Format options | Date |
|---|---|---|---|---|
| * | Radiation & reliability report | TMP9R01-SEP Production Flow and Reliability Report (Rev. A) | PDF | HTML | 31 Jul 2025 |
| * | Radiation & reliability report | TMP9R01-SEP Total Ionizing Dose (TID) Report (Rev. C) | 27 Jun 2025 | |
| * | Radiation & reliability report | TMP9R01-SEP Single-Event Effects (SEE) Radiation Test Report (Rev. B) | PDF | HTML | 19 Jun 2025 |
| Selection guide | TI Space Products (Rev. L) | 27 Mar 2026 | ||
| Application note | How to Optimize Space-Grade Temperature Sensing Designs | PDF | HTML | 27 Oct 2025 | |
| Product overview | TI Space Qualified Temperature Sensor Product Selection Guide (Rev. A) | PDF | HTML | 22 Jan 2025 | |
| Application note | Remote Temperature Transistor Sensor Selection Guide | PDF | HTML | 24 Mar 2021 |
For additional terms or required resources, click any title below to view the detail page where available.
This is a 6U VPX form factor highlighting the AMD-Xilinx® Versal AI Core XQRVC1902 adaptable SoC/FPGA. The ADM-VA600 is modular board design with one FMC+ connector, DDR4 DRAM and system monitoring. The majority of the components are radiation-tolerant power management, interface, clocking and (...)
This is a 3U VPX form factor highlighting the AMD-Xilinx® Versal AI Edge XQRVE2302 Adaptable SoC/FPGA. The ADM-VB630 is singleboard computer board. The majority of the components are radiation-tolerant power management, interface and sensing (-SEP) portfolio.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| VSSOP (DGS) | 10 | Ultra Librarian |
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