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TMUX1237

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3-Ω low ron, 5-V, 2:1 (SPDT) general purpose switch with no overshoot when switching inputs

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 1 Power supply voltage - single (V) 1.2, 1.8, 3.3, 5 Ron (Typ) (Ohms) 3 ON-state leakage current (Max) (µA) 0.08 Bandwidth (MHz) 250 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (Max) (mA) 30 Rating Catalog CON (Typ) (pF) 23 Supply current (Typ) (uA) 0.003 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOT-SC70 (DCK) 6 4 mm² 2 x 2.1 open-in-new Find other Analog switches & muxes

Features

  • No Overshoot When Switching Inputs
  • Rail-to-rail Operation
  • Bidirectional Signal Path
  • 1.8 V Logic Compatible
  • Fail-safe Logic
  • Low On-resistance: 3 Ω
  • Wide Supply Range: 1.08 V to 5.5 V
  • -40°C to +125°C Operating Temperature
  • Low Supply Current: 7 nA
  • Break-before-make Switching
  • ESD Protection HBM: 2000 V

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Description

The TMUX1237 is a general purpose 2:1, single-pole double-throw (SPDT), switch that supports a wide operating range of 1.08 V to 5.5 V. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD. The state of the select pin (SEL) controls which of the two sources pins are connected to the drain pin. Additionally, the TMUX1237 has a low supply current of 7 nA which enables the device to be used in a host of handheld or low power applications.

The TMUX1237 improves system reliability by eliminating overshoot that might occur in a system due to switching between two voltage levels on the source (Sx) pins. In addition, the TMUX1237 also maintains fast switching times, enabling it to improve system performance for a wide range of applications from communications equipment to building automation.

All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

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Technical documentation

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Type Title Date
* Datasheet TMUX1237 3-Ω Low RON, 5-V, 2:1 (SPDT) General Purpose Switch With No Overshoot When Switching Inputs datasheet (Rev. A) Mar. 24, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019

Design & development

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Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
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Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Design tools & simulation

SIMULATION MODELS Download
SCDM235A.ZIP (8 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
SC70 (DCK) 6 View options

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