LEADED-ADAPTER1
Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages
LEADED-ADAPTER1
Overview
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Analog switches & muxes
Auto bidirectional voltage translators
Protocol-specific switches & muxes
Order & start development
Interface adapter
EVM-LEADED1 – Surface Mount to DIP Header Adapter for Quick Testing of TIs 5,8,10,16, and 24 pin Leaded Packages
Technical documentation
= Top documentation selected by TI
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Type | Title | Date | |
---|---|---|---|
* | User guide | EVM-LEADED1 User's Guide | Jan. 24, 2018 |
More literature | EVM-LEADED1 EU Declaration of Conformity (DoC) | Jan. 02, 2019 |
Support & training
TI E2E™ forums with technical support from TI engineers
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