4-channel ESD solution for high-speed Differential interface
Product details
Parameters
Package | Pins | Size
Features
- IEC 61000-4-2 Level 4 ESD Protection
- ±8-kV Contact Discharge
- IEC 61000-4-5 Surge Protection
- 2.5A (8/20µs)
- I/O Capacitance: 0.8 pF (Typical)
- Low Leakage Current: 10 nA (Typical)
- Supports High-Speed Differential Data Rates
(3-dB Bandwidth > 4 GHz) - Ultra-low Matching Capacitance Between
Differential Signal Pairs - Ioff Feature for the TPD4S009
- Industrial Temperature Range:
–40°C to 85°C - Easy Straight through Routing, Space-Saving
Package Options
Description
The TPD4S009 and TPD4S010 are four-channel TVS diode arrays for electrostatic discharge (ESD) protection. TPD4S009 and TPD4S010 are rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4), with ±8-kV contact discharge ESD protection. The low capacitance (0.8-pF) of these devices, coupled with the excellent matching between differential signal pairs (0.05-pF line-line capacitance for the TPD4S009DRY) enables this device to provide transient voltage suppression circuit protection for high-speed differential data rates (3-dB bandwidth > 4 GHz).
The TPD4S009 is offered in DBV, DCK, DGS, and DRY packages. The TPD4S009DRYR is the most space saving package option available for dual pair high-speed differential lines. The TPD4S010 is offered in the industry standard DQA package. The TPD4S009DGSR and TPD4S010DQAR offer flow-through board layout options to reduce signal glitches normally caused by routing mismatches between the D+ and D– signal pair. See also TPD4E05U06DQAR which is P2P compatible with TPD4S010DQAR. This device offers higher IEC ESD protection, lower capacitance, lower RDYN, lower DC breakdown voltage, and lower clamping voltage.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | TPD4S009 4-Channel ESD Solution for High-Speed Differential Interface datasheet (Rev. G) | Jun. 26, 2015 |
| User guides | Generic ESD Evaluation Module User's Guide | Apr. 03, 2018 | |
| Selection guides | System-Level ESD Protection Guide (Rev. C) | Feb. 20, 2018 | |
| White papers | Designing USB for short-to-battery tolerance in automotive environments | Feb. 10, 2016 | |
| Application notes | ESD Layout Guide | Mar. 04, 2015 | |
| Application notes | Design Considerations for System-Level ESD Circuit Protection | Sep. 25, 2012 | |
| Application notes | Reading and Understanding an ESD Protection Datasheet | May 19, 2010 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The DLP® LightCrafter™ 6500 is a high performance, yet flexible evaluation module for incorporating DLP technology into a wide variety light steering applications. This EVM is an easy path for those developing solutions requiring high resolution, optical throughput and brightness at a (...)
Features
- Display images or video up to 1080p resolution (1920x1080 array)
- High speed patterns using the DLPC900
- Up to 9,523 Hz binary pattern rate
- Up to 247 Hz 8-bit grayscale pattern rate
- 2 Configurable I/O trigger for synchronizing with cameras, sensors, or other peripherals
- USB 1.1, HDMI and I2C interfaces
- (...)
Description
The DLP® LightCrafter™ 9000 is a high performance and highly flexible development kit for incorporating DLP technology into a wide variety light steering applications. This EVM is an easy path for solutions maximizing resolution, optical throughput and brightness.
At the heart of DLP LightCrafter 9000 (...)
Features
DLP9000
- Development- LightCrafter 9000 EVM
- Maximum Bandwidth- >40 Gbps
- Maximum Binary Pattern Rate- 9.5 kHZ
- DLP Digital Controller-DLPC900
- DLP PROM-DLPR900
- Wavelength Range- 400-700 nm
- Micromirror Array Size- 2560 x 1600
- Display Resolution- WQXGA
- Micromirror Array Diagonal- 0.9 inches
- Micromirror Pixel Pitch (...)
Description
The DRV8353RH-EVM is a 15A, 3-phase brushless DC drive stage based on the DRV8353RH gate driver and CSD19532Q5B NexFET™ MOSFETs.
The module has individual DC bus and phase voltage sense as well as individual low-side current shunt amplifiers, making this evaluation module ideal for sensorless BLDC (...)
Features
- 9- to 95-V operation
- 15 A continuous / 20 A peak H-bridge output current
- Internal buck regulator
- Three individual, internal low-side current shunt amplifiers
- INSTASPIN FOC firmware available
Description
The DRV8353RS-EVM is a 15A, 3-phase brushless DC drive stage based on the DRV8353RS gate driver and CSD19532Q5B NexFET™ MOSFETs.
The module has individual DC bus and phase voltage sense as well as individual low-side current shunt amplifiers, making this evaluation module ideal for sensorless BLDC (...)
Features
- 9- to 95-V operation
- 15 A continuous / 20 A peak H-bridge output current
- Internal buck regulator
- Three individual, internal low-side current shunt amplifiers
- INSTASPIN FOC firmware available
Description
Features
- Allows testing of most TI ESD devices
- Many footprints to allow testing of each part
- S-parameter testing for signal integrity
Design tools & simulation
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| USON (DQA) | 10 | View options |
Ordering & quality
Support & training
TI E2E™ forums with technical support from TI engineers
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Training series
View all TI training and videosVideos
Design Considerations for system-level ESD protection
Roger Liang, a systems engineer at Texas Instruments, explains what Electrostatic Discharge (ESD) is, and how it can occur and cause damage to our electronics.
