Quad 0.8-pF, 5.5-V, ±8-kV ESD protection diode with 5-A 8/20-uS surge rating for USB 3.0
Product details
Parameters
Package | Pins | Size
Features
- IEC 61000-4-2 Level 4 ESD Protection
- ±8-kV Contact Discharge
- IEC 61000-4-5 Surge Protection
- 2.5A (8/20µs)
- I/O Capacitance: 0.8 pF (Typical)
- Low Leakage Current: 10 nA (Typical)
- Supports High-Speed Differential Data Rates
(3-dB Bandwidth > 4 GHz) - Ultra-low Matching Capacitance Between
Differential Signal Pairs - Ioff Feature for the TPD4S009
- Industrial Temperature Range:
–40°C to 85°C - Easy Straight through Routing, Space-Saving
Package Options
Description
The TPD4S009 and TPD4S010 are four-channel TVS diode arrays for electrostatic discharge (ESD) protection. TPD4S009 and TPD4S010 are rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4), with ±8-kV contact discharge ESD protection. The low capacitance (0.8-pF) of these devices, coupled with the excellent matching between differential signal pairs (0.05-pF line-line capacitance for the TPD4S009DRY) enables this device to provide transient voltage suppression circuit protection for high-speed differential data rates (3-dB bandwidth > 4 GHz).
The TPD4S009 is offered in DBV, DCK, DGS, and DRY packages. The TPD4S009DRYR is the most space saving package option available for dual pair high-speed differential lines. The TPD4S010 is offered in the industry standard DQA package. The TPD4S009DGSR and TPD4S010DQAR offer flow-through board layout options to reduce signal glitches normally caused by routing mismatches between the D+ and D– signal pair. See also TPD4E05U06DQAR which is P2P compatible with TPD4S010DQAR. This device offers higher IEC ESD protection, lower capacitance, lower RDYN, lower DC breakdown voltage, and lower clamping voltage.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Data sheet | TPD4S009 4-Channel ESD Solution for High-Speed Differential Interface datasheet (Rev. G) | Jun. 26, 2015 |
| User guide | Generic ESD Evaluation Module User's Guide | Apr. 03, 2018 | |
| Selection guide | System-Level ESD Protection Guide (Rev. C) | Feb. 20, 2018 | |
| White paper | Designing USB for short-to-battery tolerance in automotive environments | Feb. 10, 2016 | |
| Application note | ESD Layout Guide | Mar. 04, 2015 | |
| Application note | Design Considerations for System-Level ESD Circuit Protection | Sep. 25, 2012 | |
| Application note | Reading and Understanding an ESD Protection Datasheet | May 19, 2010 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The DRV8353RH-EVM is a 15A, 3-phase brushless DC drive stage based on the DRV8353RH gate driver and CSD19532Q5B NexFET™ MOSFETs.
The module has individual DC bus and phase voltage sense as well as individual low-side current shunt amplifiers, making this evaluation module ideal for sensorless BLDC (...)
Features
- 9- to 95-V operation
- 15 A continuous / 20 A peak H-bridge output current
- Internal buck regulator
- Three individual, internal low-side current shunt amplifiers
- INSTASPIN FOC firmware available
Description
The DRV8353RS-EVM is a 15A, 3-phase brushless DC drive stage based on the DRV8353RS gate driver and CSD19532Q5B NexFET™ MOSFETs.
The module has individual DC bus and phase voltage sense as well as individual low-side current shunt amplifiers, making this evaluation module ideal for sensorless BLDC (...)
Features
- 9- to 95-V operation
- 15 A continuous / 20 A peak H-bridge output current
- Internal buck regulator
- Three individual, internal low-side current shunt amplifiers
- INSTASPIN FOC firmware available
Description
Features
- Allows testing of most TI ESD devices
- Many footprints to allow testing of each part
- S-parameter testing for signal integrity
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| USON (DQA) | 10 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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