Isolation in Powered-Off Mode, V_CC = 0
Low ON-State Resistance (0.9 Ω)
Control Inputs Are 5.5-V Tolerant
Low Charge Injection
Low Total Harmonic Distortion (THD)
1.65-V to 5.5-V Single-Supply Operation
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
  (A114-B, Class II)
- 1000-V Charged-Device Model (C101)

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The TS5A3167 is a bidirectional, single-channel, single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 5.5 V. The TS5A3167 device offers a low ON-state resistance. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.

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Technical documentation

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	Type	Title	Date
*	Datasheet	TS5A3167 0.9-Ω 1-channel 1:1 SPST Analog Switch datasheet (Rev. C)	Aug. 23, 2018
	Application note	Selecting the Right Texas Instruments Signal Switch (Rev. B)	Apr. 02, 2020
	Application note	Multiplexers and Signal Switches Glossary	Mar. 06, 2020
	Application note	Eliminate power Sequencing with powered-off protection signal switches (Rev. B)	Jan. 15, 2019
	Application note	Preventing Excess Power Consumption on Analog Switches	Jul. 03, 2008
	Application note	Semiconductor Packing Material Electrostatic Discharge (ESD) Protection	Jul. 08, 2004

Design & development

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Hardware development

EVALUATION BOARD Download

DIP Adapter Evaluation Module

DIP-ADAPTER-EVM

Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

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Features

Simplifies prototyping of SMT IC’s
Supports 6 common package types
Low Cost

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INTERFACE ADAPTER Download

Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

LEADLESS-ADAPTER1

Description

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.