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TS5A3167

ACTIVE
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0.9-Ω on-state resistance, 5-V, 1:1 (SPST), 1-channel analog switch (active low)

Data sheet
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0.9-Ω on-state resistance, 5-V, 1:1 (SPST), 1-channel analog switch (active low)

TS5A3167

ACTIVE
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Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 0.75 ON-state leakage current (Max) (µA) 0.05 Bandwidth (MHz) 200 Operating temperature range (C) -40 to 85 Features Powered-off protection Input/output continuous current (Max) (mA) 200 Rating Catalog CON (Typ) (pF) 35.5 Supply current (Typ) (uA) 0.01 open-in-new Find other Analog switches & muxes

Package | Pins | Size

DSBGA (YZP) 5 2 mm² .928 x 1.428 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1 open-in-new Find other Analog switches & muxes

Features

  • Isolation in Powered-Off Mode, VCC = 0
  • Low ON-State Resistance (0.9 Ω)
  • Control Inputs Are 5.5-V Tolerant
  • Low Charge Injection
  • Low Total Harmonic Distortion (THD)
  • 1.65-V to 5.5-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

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Description

The TS5A3167 is a bidirectional, single-channel, single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 5.5 V. The TS5A3167 device offers a low ON-state resistance. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.

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Technical documentation

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Type Title Date
* Data sheet TS5A3167 0.9-Ω 1-channel 1:1 SPST Analog Switch datasheet (Rev. C) Aug. 23, 2018
Application note Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) Jan. 06, 2021
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
10
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
View details
INTERFACE ADAPTER Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel
View details

Design tools & simulation

SIMULATION MODEL Download
SCDM084.ZIP (94 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 5 View options
SC70 (DCK) 5 View options
SOT-23 (DBV) 5 View options

Ordering & quality

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  • MSL rating/Peak reflow
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  • Qualification summary
  • Ongoing reliability monitoring

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