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Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages LEADLESS-ADAPTER1 (ACTIVE)
Key Document
- EVM-LEADLESS1 User's Guide
(PDF 372 KB)
24 Jan 2018
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Order Now
| Part Number | Buy from Texas Instruments or Third Party | Buy from Authorized Distributor | Status | |||||||
EVM-LEADLESS1: |
Pricing may vary.
|
ACTIVE | ||||||||
| Contact a Distributor | ||||||||||
TI's Standard Terms and Conditions for Evaluation Items apply.
Technical Documents
User guides (1)
| Title | Type | Size (KB) | Date |
| 372 | 24 Jan 2018 |
More literature (1)
| Title | Type | Size (KB) | Date |
| 38 | 02 Jan 2019 |
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