LEADLESS-ADAPTER1
Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages
LEADLESS-ADAPTER1
Overview
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Analog switches & muxes
Protocol-specific switches & muxes
Order & start development
Interface adapter
EVM-LEADLESS1 – Surface Mount to DIP Header Adapter for Quick Testing of TIs 6,8,10,12,14,16, and 20 Pin Leadless Packages
Technical documentation
= Top documentation selected by TI
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Type | Title | Date | |
---|---|---|---|
* | User guide | EVM-LEADLESS1 User's Guide | Jan. 24, 2018 |
More literature | EVM-LEADLESS1 EU Declaration of Conformity (DoC) | Jan. 02, 2019 |
Support & training
TI E2E™ forums with technical support from TI engineers
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