Información de empaque
Encapsulado | Pines PicoStar (YMG) | 4 |
Rango de temperatura de funcionamiento (℃) -55 to 150 |
Cant. de paquetes | Transportador 3,000 | LARGE T&R |
Características para CSD22205L
- Low resistance
- Small footprint 1.2 mm × 1.2 mm
- Low profile 0.36-mm height
- Lead free
- Gate-source voltage clamp
- Gate ESD protection
- RoHS compliant
- Halogen free
Descripción de CSD22205L
This –8-V, 8.2-mΩ, 1.2-mm × 1.2-mm Land Grid Array (LGA) NexFET™ device has been designed to deliver the lowest on-resistance and gate charge in the smallest outline possible with excellent thermal characteristics in an ultra-low profile. The Land Grid Array (LGA) package is a silicon chip scale package with metal pads instead of solder balls.