Información de empaque
| Encapsulado | Pines SOIC (D) | 8 |
| Rango de temperatura de funcionamiento (℃) -40 to 125 |
| Cant. de paquetes | Transportador 95 | TUBE |
Características para DS90LV027AH
- −40°C to +125°C Operating Temperature Range
- >600-Mbps (300-MHz) Switching Rates
- 0.3-ns Typical Differential Skew
- 0.7-ns Maximum Differential Skew
- 3.3-V Power Supply Design
- Low power dissipation (46 mW at 3.3-V Static)
- Flow-Through Design Simplifies PCB Layout
- Power Off Protection (Outputs in High Impedance)
- Conforms to TIA/EIA-644 Standard
- 8-Pin SOIC Package Saves Space
Descripción de DS90LV027AH
The DS90LV027AH is a dual LVDS driver device optimized for high data rate and low power applications. The device is designed to support data rates in excess of 600Mbps (300MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. The DS90LV027AH is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized.
The device is in a 8-lead SOIC package. The DS90LV027AH has a flow-through design for easy PCB layout. The differential driver outputs provides low EMI with its typical low output swing of 360 mV. It is perfect for high speed transfer of clock and data. The DS90LV027AH can be paired with its companion dual line receiver, the DS90LV028AH, or with any of TI’s LVDS receivers, to provide a high-speed point-to-point LVDS interface.