Información de empaque
| Encapsulado | Pines HTQFP (PZP) | 100 |
| Rango de temperatura de funcionamiento (℃) 0 to 70 |
| Cant. de paquetes | Transportador 1,000 | LARGE T&R |
Características para TFP401A
- Supports pixel rates up to 165 MHz (including 1080p and WUXGA at 60 Hz)
- Digital visual interface (DVI) specification compliant (1)
- True-color, 24-bit/pixel, 16.7M colors at 1 or 2 pixels per clock
- Laser trimmed internal termination resistors for optimum fixed impedance matching
- Skew tolerant up to one pixel-clock cycle
- 4× oversampling
- Reduced power consumption – 1.8-V core operation with 3.3-V I/Os and supplies (2)
- Reduced ground bounce using time-staggered pixel outputs
- Low noise and good power dissipation using TI PowerPAD™ packaging
- Advanced technology using TI 0.18-µm EPIC-5 CMOS process
- TFP401A incorporates HSYNC jitter immunity (3)
(1)The Digital Visual Interface Specification, DVI, is an industry standard developed by the Digital Display Working Group (DDWG) for high-speed digital connection to digital displays. The TPF401 and TFP401A are compliant with the DVI Specification Rev. 1.0.
(2)The TFP401/401A has an internal voltage regulator that provides the 1.8-V core power supply from the external 3.3-V supplies.
(3)The TFP401A incorporates additional circuitry to create a stable HSYNC from DVI transmitters that introduce undesirable jitter on the transmitted HSYNC signal.
Descripción de TFP401A
The Texas Instruments TFP401 and TFP401A are TI PanelBus™ flat-panel display products, part of a comprehensive family of end-to-end DVI 1.0 compliant solutions. Targeted primarily at desktop LCD monitors and digital projectors, the TFP401/401A finds applications in any design requiring high-speed digital interface.
The TFP401 and TFP401A supports display resolutions up to 1080p and WUXGA in 24-bit true-color pixel format. The TFP401 and TFP401A offers design flexibility to drive one or two pixels per clock, supports TFT or DSTN panels, and provides an option for time-staggered pixel outputs for reduced ground bounce.
PowerPAD advanced packaging technology results in best-of-class power dissipation, footprint, and ultralow ground inductance.
The TFP401 and TFP401A combines PanelBus circuit innovation with TI’s advanced 0.18-µm EPIC-5 CMOS process technology, along with TI PowerPAD package technology to achieve a reliable, low-powered, low-noise, high-speed digital interface solution.