AM3505AZCNA image

AM3505AZCNA 활성

Sitara 프로세서: Arm Cortex-A8, 비디오 프론트 엔드

가격

수량 가격
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품질 정보

등급 Catalog
RoHS
REACH
납 마감/볼 재질 SNAGCU
MSL 등급/피크 리플로우 Level-3-260C-168 HR
품질, 신뢰성
및 패키징 정보

포함된 정보:

  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
보기 또는 다운로드
추가 제조 정보

포함된 정보:

  • 팹 위치
  • 조립 위치
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수출 분류

*참조 목적

  • US ECCN: 3A991A2

패키징 정보

패키지 | 핀 NFBGA (ZCN) | 491
작동 온도 범위(°C) -40 to 105
패키지 수량 | 캐리어 90 | JEDEC TRAY (5+1)

AM3505의 주요 특징

  • AM3517/05 Sitara Processor:
    • MPU Subsystem
      • 600-MHz Sitara ARM Cortex-A8 Core
      • NEON SIMD Coprocessor and Vector
        Floating-Point (FP) Coprocessor
    • Memory Interfaces:
      • 166-MHz 16- and 32-Bit mDDR/DDR2
        Interface with 1GB of Total Addressable
        Space
      • Up to 83 MHz General-Purpose Memory
        Interface Supporting 16-Bit-Wide
        Multiplexed Address/DataBus
      • 64KB of SRAM
      • 3 Removable Media Interfaces
        [MMC/SD/SDIO]
    • IO Voltage:
      • mDDR/DDR2 IOs: 1.8V
      • Other IOs: 1.8V and 3.3V
    • Core Voltage: 1.2V
    • Commercial and Extended Temperature Grade
      (operating restrictions apply)
    • 16-Bit Video Input Port Capable of
      Capturing HD Video
    • HD Resolution Display Subsystem
    • Serial Communication
      • High-End CAN Controller
      • 10/100 Mbit Ethernet MAC
      • USB OTG Subsystem with Standard
        DP/DM Interface [HS/FS/LS]
      • Multiport USB Host Subsystem [HS/FS/LS]
        • 12-Pin ULPI or 6-, 4-, or 3-Pin Serial
          Interface
      • Four Master and Slave Multichannel Serial
        Port Interface(McSPI) Ports
      • Five Multichannel Buffered Serial Ports (McBSPs)
        • 512-Byte Transmit and Receive Buffer
          (McBSP1/3/4/5)
        • 5-KB Transmit and Receive Buffer (McBSP2)
        • SIDETONE Core Support (McBSP2 and
          McBSP3 Only)For Filter, Gain, and Mix
          Operations
        • 128-Channel Transmit and Receive Mode
        • Direct Interface to I2S and PCM Device and
          TDM Buses
      • HDQ/1-Wire Interface
      • 4 UARTs (One with Infrared Data Association
        [IrDA] and Consumer Infrared [CIR] Modes)
      • 3 Master and Slave High-Speed Inter-Integrated
        Circuit (I2C) Controllers
      • Twelve 32-bit General-Purpose Timers
      • One 32-bit Watchdog Timer
      • One 32-bit 32-kHz Sync Timer
      • Up to 186 General-Purpose I/O (GPIO) Pins
  • Display Subsystem
    • Parallel Digital Output
    • Up to 24-Bit RGB
    • Supports Up to 2 LCD Panels
    • Support for Remote Frame Buffer Interface (RFBI)
      LCD Panels
    • Two 10-Bit Digital-to-Analog Converters (DACs)
      Supporting
      • Composite NTSC/PAL Video
      • Luma/Chroma Separate Video (S-Video)
    • Rotation of 90, 180, and 270 Degrees
    • Resize Images From 1/4x to 8x
    • Color Space Converter
    • 8-Bit Alpha Blending
  • Video Processing Front End (VPFE) 16-Bit Video Input Port
    • RAW Data Interface
    • 75-MHz Maximum Pixel Clock
    • Supports REC656/CCIR656 Standard
    • Supports YCbCr422 Format (8-Bit or 16-Bit with Discrete
      Horizontal and Vertical Sync Signals)
    • Generates Optical Black Clamping Signals
    • Built-in Digital Clamping and Black Level Compensation
    • 10-Bit to 8-Bit A-law Compression Hardware
    • Supports up to 16K Pixels (Image Size) in Horizontal
      and Vertical Directions
  • System Direct Memory Access (sDMA) Controller (32 Logical
    Channels with Configurable Priority)
  • Comprehensive Power, Reset, and Clock Management
  • ARM Cortex-A8 Memory Architecture
    • ARMv7 Architecture
      • In-Order, Dual-Issue, Superscalar Microprocessor Core
      • ARM NEON Multimedia Architecture
      • Over 2x Performance of ARMv6 SIMD
      • Supports Both Integer and Floating-Point SIMD
      • Jazelle RCT Execution Environment Architecture
      • Dynamic Branch Prediction with Branch Target Address
        Cache, Global History Buffer and 8-Entry Return Stack
      • Embedded Trace Macrocell [ETM] Support for
        Noninvasive Debug
      • 16KB of Instruction Cache (4-Way Set-Associative)
      • 16KB of Data Cache (4-Way Set-Associative)
      • 256KB of L2 Cache
    • PowerVR SGX Graphics Accelerator (AM3517 Only)
      • Tile-Based Architecture Delivering up to 10 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine
        Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and
        2.0, OpenVG1.0
      • Fine-Grained Task Switching, Load Balancing, and
        Power Management
      • Programmable, High-Quality Image Anti-Aliasing
    • Endianess
      • ARM Instructions – Little Endian
      • ARM Data – Configurable
    • SDRC Memory Controller
      • 16- and 32-Bit Memory Controller with 1GB of
        Total Address Space
      • Double Data Rate (DDR2) SDRAM, Mobile Double Data Rate
        (mDDR)SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-Bit-Wide Multiplexed Address/Data Bus
      • Up to 8 Chip-Select Pins with 128MB of Address
        Space per Chip-Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (with ECC
        Hamming Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface
        to Custom Logic (FPGA, CPLD, ASICs, and so forth)
      • Nonmultiplexed Address/Data Mode (Limited 2-KB
        Address Space)
    • Test Interfaces
      • IEEE-1149.1 (JTAG) Boundary-Scan Compatible
      • Embedded Trace Macro Interface (ETM)
    • 65-nm CMOS Technology
    • Packages:
      • 491-Pin BGA (17 x 17, 0.65-mm Pitch)
        [ZCN Suffix]
        with Via Channel Array
        Technology
      • 484-Pin PBGA (23 x 23, 1-mm Pitch)
        [ZER Suffix]

    AM3505에 대한 설명

    AM3517/05 is a high-performance ARM Cortex-A8 microprocessor with speeds up to 600 MHz. The device offers 3D graphics acceleration while also supporting numerous peripherals, including DDR2, CAN, EMAC, and USB OTG PHY that are well suited for industrial apllications.

    The processor can support other applications, including: Single-board computers Home and industrial automation Human machine Interface

    The device supports high-level operating systems (OSs), such as:

    • Linux®
    • Windows® CE
    • Android™

    The following subsystems are part of the device:

    • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
    • PowerVR SGX graphics accelerator (AM3517 device only) subsystem for 3D graphics acceleration to support display and gaming effects
    • Display subsystem with several features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out.
    • High-performance interconnects provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals. The device also offers a comprehensive clock-management scheme.

    AM3517/05 devices are available in a 491-pin BGA package and a 484-pin PBGA package.

    This AM3517/05 data manual presents the electrical and mechanical specifications for the AM3517/05 Sitara processor.

    가격

    수량 가격
    +

    캐리어 옵션

    전체 릴, 맞춤형 수량의 릴, 절단 테이프, 튜브, 트레이 등 부품 수량에 따라 다양한 캐리어 옵션을 선택할 수 있습니다.

    맞춤형 릴은 한 릴에서 절단 테이프의 연속 길이로, 로트 및 날짜 코드 추적 기능을 유지하여 요청한 정확한 양을 유지합니다. 업계 표준에 따라, 황동 심으로 절단 테이프 양쪽에 18인치 리더와 트레일러를 연결하여 자동화 조립 기계에 직접 공급합니다. TI는 맞춤형 수량의 릴 주문 시 릴 요금을 부과합니다.

    절단 테이프란 릴에서 잘라낸 테이프 길이입니다. TI는 요청 수량을 맞추기 위해 여러 가닥의 절단 테이프 또는 박스를 사용하여 주문을 이행할 수 있습니다.

    TI는 종종 재고 가용성에 따라 튜브 또는 트레이 디바이스를 박스나 튜브 또는 트레이로 배송합니다. TI는 내부 정전 방전 및 습도 민감성 수준 보호 요구 사항에 따라 모든 테이프, 튜브 또는 샘플 박스를 포장합니다.

    자세히 보기

    로트 및 날짜 코드를 선택할 수 있습니다.

    장바구니에 수량을 추가하고 결제 프로세스를 시작하여 기존 재고에서 로트 또는 날짜 코드를 선택할 수 있는 옵션을 확인합니다.

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