패키징 정보
| 패키지 | 핀 FCBGA (ABD) | 1089 |
| 작동 온도 범위(°C) -40 to 100 |
| 패키지 수량 | 캐리어 40 | JEDEC TRAY (5+1) |
AM5K2E04의 주요 특징
- ARM® Cortex®-A15 MPCore™ CorePac
- Up to Four ARM Cortex-A15 Processor Cores at
up to 1.4-GHz - 4MB L2 Cache Memory Shared by all Cortex-
A15 Processor Cores - Full Implementation of ARMv7-A Architecture
Instruction Set - 32KB L1 Instruction and Data Caches per Core
- AMBA 4.0 AXI Coherency Extension (ACE)
Master Port, Connected to MSMC (Multicore
Shared Memory Controller) for Low Latency
Access to SRAM and DDR3
- Up to Four ARM Cortex-A15 Processor Cores at
- Multicore Shared Memory Controller (MSMC)
- 2 MB SRAM Memory for ARM CorePac
- Memory Protection Unit for Both SRAM and
DDR3_EMIF
- Multicore Navigator
- 8k Multi-Purpose Hardware Queues with Queue
Manager - One Packet-Based DMA Engine for Zero-
Overhead Transfers
- 8k Multi-Purpose Hardware Queues with Queue
- Network Coprocessor
- Packet Accelerator Enables Support for
- Transport Plane IPsec, GTP-U, SCTP,
PDCP - L2 User Plane PDCP (RoHC, Air Ciphering)
- 1 Gbps Wire Speed Throughput at 1.5
MPackets Per Second
- Transport Plane IPsec, GTP-U, SCTP,
- Security Accelerator Engine Enables Support for
- IPSec, SRTP, 3GPP and WiMAX Air
Interface, and SSL/TLS Security - ECB, CBC, CTR, F8, A5/3, CCM, GCM,
HMAC, CMAC, GMAC, AES, DES, 3DES,
Kasumi, SNOW 3G, SHA-1, SHA-2 (256-bit
Hash), MD5 - Up to 6.4 Gbps IPSec and 3 Gbps Air
Ciphering
- IPSec, SRTP, 3GPP and WiMAX Air
- Ethernet Subsystem
- Eight SGMII Ports with Wire Rate Switching
- IEEE1588 v2 (with Annex D/E/F) Support
- 8 Gbps Total Ingress/Egress Ethernet BW
from Core - Audio/Video Bridging (802.1Qav/D6.0)
- QOS Capability
- DSCP Priority Mapping
- Packet Accelerator Enables Support for
- Peripherals
- Two PCIe Gen2 Controllers with Support for
- Two Lanes per Controller
- Supports Up to 5 GBaud
- One HyperLink
- Supports Connections to Other KeyStone Architecture
Devices Providing Resource
Scalability - Supports Up to 50 GBaud
- Supports Connections to Other KeyStone Architecture
- 10-Gigabit Ethernet (10-GbE) Switch Subsystem
- Two SGMII/XFI Ports with Wire Rate
Switching and MACSEC Support - IEEE1588 v2 (with Annex D/E/F) Support
- Two SGMII/XFI Ports with Wire Rate
- One 72-Bit DDR3/DDR3L Interface with Speeds Up
to 1600 MTPS in DDR3 Mode - EMIF16 Interface
- Two USB 2.0/3.0 Controllers
- USIM Interface
- Two UART Interfaces
- Three I2C Interfaces
- 32 GPIO Pins
- Three SPI Interfaces
- One TSIP
- Support 1024 DS0s
- Support 2 Lanes at 32.768/16.3848.192
Mbps Per Lane
- Two PCIe Gen2 Controllers with Support for
- System Resources
- Three On-Chip PLLs
- SmartReflex Automatic Voltage Scaling
- Semaphore Module
- Twelve 64-Bit Timers
- Five Enhanced Direct Memory Access (EDMA)
Modules
- Commercial Case Temperature:
- 0°C to 85°C
- Extended Case Temperature:
- –40°C to 100°C
AM5K2E04에 대한 설명
The AM5K2E0x is a high performance device based on TI’s KeyStone II Multicore SoC Architecture, incorporating the most performance-optimized Cortex-A15 processor dual-core or quad-core CorePac that can run at a core speed of up to 1.4 GHz. TI’s AM5K2E0x device enables a high performance, power-efficient and easy to use platform for developers of a broad range of applications such as enterprise grade networking end equipment, data center networking, avionics and defense, medical imaging, test and automation.
TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (for example, ARM CorePac (Cortex-A15 Processor Quad Core CorePac), network processing, and uses a queue-based communication system that allows the device resources to operate efficiently and seamlessly. This unique device architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to high-speed IO, to each operate at maximum efficiency with no blocking or stalling.
The AM5K2E0x KeyStone II device integrates a large amount of on-chip memory. The Cortex-A15 processor cores each have 32KB of L1Data and 32KB of L1 Instruction cache. The up to four Cortex A15 cores in the ARM CorePac share a 4MB L2 Cache. The device also integrates 2MB of Multicore Shared Memory (MSMC) that can be used as a shared L3 SRAM. All L2 and MSMC memories incorporate error detection and error correction. For fast access to external memory, this device includes a 64-bit DDR-3 (72-bit with ECC support) external memory interface (EMIF) running at 1600 MTPS.
The device enables developers to use a variety of development and debugging tools that include GNU GCC, GDB, Open source Linux, Eclipse based debugging environment enabling kernel and user space debugging using a variety of Eclipse plug-ins including TI's industry leading IDE Code Composer Studio.