AM3505AZCNA image

AM3505AZCNA 現行

Sitara 處理器:Arm Cortex-A8、視訊前端

定價

數量 價格
+

品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 SNAGCU
MSL 等級 / 迴焊峰值 Level-3-260C-168 HR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:3A991A2

封裝資訊

封裝 | 引腳 NFBGA (ZCN) | 491
作業溫度範圍 (°C) -40 to 105
包裝數量 | 運送包裝 90 | JEDEC TRAY (5+1)

AM3505 的特色

  • AM3517/05 Sitara Processor:
    • MPU Subsystem
      • 600-MHz Sitara ARM Cortex-A8 Core
      • NEON SIMD Coprocessor and Vector
        Floating-Point (FP) Coprocessor
    • Memory Interfaces:
      • 166-MHz 16- and 32-Bit mDDR/DDR2
        Interface with 1GB of Total Addressable
        Space
      • Up to 83 MHz General-Purpose Memory
        Interface Supporting 16-Bit-Wide
        Multiplexed Address/DataBus
      • 64KB of SRAM
      • 3 Removable Media Interfaces
        [MMC/SD/SDIO]
    • IO Voltage:
      • mDDR/DDR2 IOs: 1.8V
      • Other IOs: 1.8V and 3.3V
    • Core Voltage: 1.2V
    • Commercial and Extended Temperature Grade
      (operating restrictions apply)
    • 16-Bit Video Input Port Capable of
      Capturing HD Video
    • HD Resolution Display Subsystem
    • Serial Communication
      • High-End CAN Controller
      • 10/100 Mbit Ethernet MAC
      • USB OTG Subsystem with Standard
        DP/DM Interface [HS/FS/LS]
      • Multiport USB Host Subsystem [HS/FS/LS]
        • 12-Pin ULPI or 6-, 4-, or 3-Pin Serial
          Interface
      • Four Master and Slave Multichannel Serial
        Port Interface(McSPI) Ports
      • Five Multichannel Buffered Serial Ports (McBSPs)
        • 512-Byte Transmit and Receive Buffer
          (McBSP1/3/4/5)
        • 5-KB Transmit and Receive Buffer (McBSP2)
        • SIDETONE Core Support (McBSP2 and
          McBSP3 Only)For Filter, Gain, and Mix
          Operations
        • 128-Channel Transmit and Receive Mode
        • Direct Interface to I2S and PCM Device and
          TDM Buses
      • HDQ/1-Wire Interface
      • 4 UARTs (One with Infrared Data Association
        [IrDA] and Consumer Infrared [CIR] Modes)
      • 3 Master and Slave High-Speed Inter-Integrated
        Circuit (I2C) Controllers
      • Twelve 32-bit General-Purpose Timers
      • One 32-bit Watchdog Timer
      • One 32-bit 32-kHz Sync Timer
      • Up to 186 General-Purpose I/O (GPIO) Pins
  • Display Subsystem
    • Parallel Digital Output
    • Up to 24-Bit RGB
    • Supports Up to 2 LCD Panels
    • Support for Remote Frame Buffer Interface (RFBI)
      LCD Panels
    • Two 10-Bit Digital-to-Analog Converters (DACs)
      Supporting
      • Composite NTSC/PAL Video
      • Luma/Chroma Separate Video (S-Video)
    • Rotation of 90, 180, and 270 Degrees
    • Resize Images From 1/4x to 8x
    • Color Space Converter
    • 8-Bit Alpha Blending
  • Video Processing Front End (VPFE) 16-Bit Video Input Port
    • RAW Data Interface
    • 75-MHz Maximum Pixel Clock
    • Supports REC656/CCIR656 Standard
    • Supports YCbCr422 Format (8-Bit or 16-Bit with Discrete
      Horizontal and Vertical Sync Signals)
    • Generates Optical Black Clamping Signals
    • Built-in Digital Clamping and Black Level Compensation
    • 10-Bit to 8-Bit A-law Compression Hardware
    • Supports up to 16K Pixels (Image Size) in Horizontal
      and Vertical Directions
  • System Direct Memory Access (sDMA) Controller (32 Logical
    Channels with Configurable Priority)
  • Comprehensive Power, Reset, and Clock Management
  • ARM Cortex-A8 Memory Architecture
    • ARMv7 Architecture
      • In-Order, Dual-Issue, Superscalar Microprocessor Core
      • ARM NEON Multimedia Architecture
      • Over 2x Performance of ARMv6 SIMD
      • Supports Both Integer and Floating-Point SIMD
      • Jazelle RCT Execution Environment Architecture
      • Dynamic Branch Prediction with Branch Target Address
        Cache, Global History Buffer and 8-Entry Return Stack
      • Embedded Trace Macrocell [ETM] Support for
        Noninvasive Debug
      • 16KB of Instruction Cache (4-Way Set-Associative)
      • 16KB of Data Cache (4-Way Set-Associative)
      • 256KB of L2 Cache
    • PowerVR SGX Graphics Accelerator (AM3517 Only)
      • Tile-Based Architecture Delivering up to 10 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine
        Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and
        2.0, OpenVG1.0
      • Fine-Grained Task Switching, Load Balancing, and
        Power Management
      • Programmable, High-Quality Image Anti-Aliasing
    • Endianess
      • ARM Instructions – Little Endian
      • ARM Data – Configurable
    • SDRC Memory Controller
      • 16- and 32-Bit Memory Controller with 1GB of
        Total Address Space
      • Double Data Rate (DDR2) SDRAM, Mobile Double Data Rate
        (mDDR)SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-Bit-Wide Multiplexed Address/Data Bus
      • Up to 8 Chip-Select Pins with 128MB of Address
        Space per Chip-Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (with ECC
        Hamming Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface
        to Custom Logic (FPGA, CPLD, ASICs, and so forth)
      • Nonmultiplexed Address/Data Mode (Limited 2-KB
        Address Space)
    • Test Interfaces
      • IEEE-1149.1 (JTAG) Boundary-Scan Compatible
      • Embedded Trace Macro Interface (ETM)
    • 65-nm CMOS Technology
    • Packages:
      • 491-Pin BGA (17 x 17, 0.65-mm Pitch)
        [ZCN Suffix]
        with Via Channel Array
        Technology
      • 484-Pin PBGA (23 x 23, 1-mm Pitch)
        [ZER Suffix]

    AM3505 的說明

    AM3517/05 is a high-performance ARM Cortex-A8 microprocessor with speeds up to 600 MHz. The device offers 3D graphics acceleration while also supporting numerous peripherals, including DDR2, CAN, EMAC, and USB OTG PHY that are well suited for industrial apllications.

    The processor can support other applications, including: Single-board computers Home and industrial automation Human machine Interface

    The device supports high-level operating systems (OSs), such as:

    • Linux®
    • Windows® CE
    • Android™

    The following subsystems are part of the device:

    • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
    • PowerVR SGX graphics accelerator (AM3517 device only) subsystem for 3D graphics acceleration to support display and gaming effects
    • Display subsystem with several features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out.
    • High-performance interconnects provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals. The device also offers a comprehensive clock-management scheme.

    AM3517/05 devices are available in a 491-pin BGA package and a 484-pin PBGA package.

    This AM3517/05 data manual presents the electrical and mechanical specifications for the AM3517/05 Sitara processor.

    定價

    數量 價格
    +

    包裝類型選項

    您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

    客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

    剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

    TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

    進一步了解

    可提供批次和日期代碼選擇

    在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

    進一步了解