48-pin (RGZ) package image

CC1352P1F3RGZR 現行

SimpleLink™ ARM Cortex-M4F 多協定低於 1 GHz 和 2.4 GHz 無線 MCU 整合式功率放大器

現行 custom-reels 客製 可提供客製捲盤

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

CC1352P1F3RGZT 現行 custom-reels 客製 可提供客製捲盤
包裝數量 | 運送包裝 250 | SMALL T&R
庫存
數量 | 價格 1ku | +

品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 NIPDAU | NIPDAUAG
MSL 等級 / 迴焊峰值 Level-3-260C-168 HR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:5A992C

封裝資訊

封裝 | 引腳 VQFN (RGZ) | 48
作業溫度範圍 (°C) -40 to 85
包裝數量 | 運送包裝 2,500 | LARGE T&R

CC1352P 的特色

  • Microcontroller
    • Powerful 48-MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • 352KB of in-system programmable flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM (alternatively available as general-purpose RAM)
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4KB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • On-chip buck DC/DC converter
    • TCXO support
  • Low power
    • Wide supply voltage range: 1.8 V to 3.8 V
    • Active mode RX: 5.8 mA (3.6 V, 868 MHz), 6.9 mA (3.0 V, 2.4 GHz)
    • Active mode TX at +20 dBm: 63 mA (3.3 V, 915 MHz), 85 mA (3.0 V, 2.4 GHz)
    • Active mode TX at +10 dBm: 22 mA (2.4 GHz)
    • Active mode MCU 48 MHz (CoreMark): 2.9 mA (60 µA/MHz)
    • Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.1 µA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808 µA
    • Standby: 0.85 µA (RTC on, 80KB RAM and CPU retention)
    • Shutdown: 150 nA (wakeup on external events)
  • Radio section
    • Multi-band sub-1 GHz and 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications, and IEEE 802.15.4 PHY and MAC
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity: -121 dBm for SimpleLink long-range mode -110 dBm at 50 kbps, -105 dBm for Bluetooth 125-kbps (LE Coded PHY)
    • Output power up to +20 dBm with temperature compensation
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • ETSI EN 300 220 Receiver Category 1.5 and 2, EN 300 328, EN 303 131, EN 303 204 (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T108 and STD-T66
    • Wide standard support
  • Wireless protocols
    • Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY, Wireless M-Bus, Wi-SUN, KNX RF, Amazon Sidewalk, proprietary systems, SimpleLink™ TI 15.4-Stack (Sub-1 GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software

CC1352P 的說明

The SimpleLink™CC1352P device is a multiprotocol and multi-band Sub-1 GHz and 2.4-GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY, Wi-SUN, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Multi-band device supporting concurrent multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver.
  • Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK).
  • Enablement of long-range and low-power applications using the integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 63 mA for Sub-1 GHz and 85 mA for 2.4 GHz operation.
  • Optimized for coin-cell operation at +10 dBm with 22 mA current consumption.
  • Longer battery life wireless applications with low standby current of 0.85 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5 µA at 85°C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1352P device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

CC1352P1F3RGZT 現行 custom-reels 客製 可提供客製捲盤
包裝數量 | 運送包裝 250 | SMALL T&R
庫存
數量 | 價格 1ku | +

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解