16-pin (DW) package image

ISO7742QDWQ1 現行

汽車、穩健 EMC、四通道、2/2、強化型數位隔離器

定價

數量 價格
+

品質資訊

等級 Automotive
RoHS
REACH
引腳鍍層 / 焊球材質 NIPDAU
MSL 等級 / 迴焊峰值 Level-2-260C-1 YEAR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:EAR99

封裝資訊

封裝 | 引腳 SOIC (DW) | 16
作業溫度範圍 (°C) -40 to 125
包裝數量 | 運送包裝 40 | TUBE

ISO7742-Q1 的特色

  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature Grade 1: –40°C to 125°C ambient operating temperature
  • Functional Safety-Capable
  • 100 Mbps data rate
  • Robust isolation barrier:
    • >30-year projected lifetime at 1500 V RMS working voltage
    • Up to 5700 V RMS isolation rating
    • Up to 12.8 kV surge capability
    • ±100 kV/µs typical CMTI
  • Wide supply range: 2.25 V to 5.5 V
  • 2.25-V to 5.5-V level translation
  • Default output high ( ISO774 x) and low ( ISO774 xF) options
  • Low power consumption, typical 1.5 mA per channel at 1 Mbps
  • Low propagation delay: 10.7 ns typical (5-V Supplies)
  • Robust electromagnetic compatibility (EMC)
    • System-level ESD, EFT, and surge immunity
    • ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
    • Low emissions
  • Extra-wide SOIC (DWW-16), wide-SOIC (DW-16) and QSOP (DBQ-16) package options
  • Safety-related certifications:
    • DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 component recognition program
    • IEC 61010-1, IEC 62368-1, IEC 60601-1, and GB 4943.1 certifications

ISO7742-Q1 的說明

The ISO774x-Q1 automotive device s are high-performance, quad-channel digital isolator s with 5700 V RMS (DWW package), 5000 V RMS (DW package) and 3000 V RMS (DBQ package) isolation ratings per UL 1577. This family of devices has reinforced insulation ratings according to VDE, CSA, TUV and CQC.

The ISO774x-Q1 device s provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by a double capacitive silicon dioxide (SiO 2) insulation barrier. These device s come with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications and to reduce power consumption. The ISO7740-Q1 device has all four channels in the same direction, the ISO7741-Q1 device has three forward and one reverse-direction channels , and the ISO7742-Q1 device has two forward and two reverse-direction channels. If the input power or signal is lost, default output is high for devices without suffix F and low for devices with suffix F. See the Device Functional Modes section for further details.

Used in conjunction with isolated power supplies, these devices help prevent noise currents on data buses, such as CAN and LIN, or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through innovative chip design and layout techniques, electromagnetic compatibility of the ISO774x-Q1 device s have been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO774x-Q1 device s are available in 16-pin wide SOIC (DW) and QSOP (DBQ) package s. ISO7741-Q1 is also available in extra-wide SOIC (DWW) package.

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解