SN54LS85
These four-bit magnitude comparators perform comparison of straight binary and straight BCD (8-4-2-1) codes. Three fully decoded decisions about two 4-bit words (A, B) are made and are externally available at three outputs. These devices are fully expandable to any number of bits without external gates. Words of greater length may be compared by connecting comparators in cascade. The A > B, A < B, and A = B outputs of a stage handling less-significant bits are connected to the corresponding A > B, A < B, and A = B inputs of the next stage handling more-significant bits. The stage handling the least-significant bits must have a high-level voltage applied to the A = B input. The cascading paths of the '85, 'LS85, and 'S85 are implemented with only a two-gate-level delay to reduce overall comparison times for long words. An alternate method of cascading which further reduces the comparison time is shown in the typical application data.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 4-Bit Magnitude Comparators datasheet | 1988年 3月 1日 | |
* | SMD | SN54LS85 SMD 5962-97547 | 2016年 6月 21日 | |
Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||
Application note | Designing With Logic (Rev. C) | 1997年 6月 1日 | ||
Application note | Designing with the SN54/74LS123 (Rev. A) | 1997年 3月 1日 | ||
Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 | ||
Application note | Live Insertion | 1996年 10月 1日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
CDIP (J) | 16 | Ultra Librarian |
CFP (W) | 16 | Ultra Librarian |
LCCC (FK) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點