337-pin (GWT) package image

TMS320F28377DGWTEP 現行

具有 800MIPS、2xCPU、2xCLA、FPU、TMU、1 MB 快閃記憶體、EMIF、16 位元 ADC 的 C2000™ 強化型產品 32 位元 MCU

與此相同: V62/18601-01XF 此零件編號與上方所列零件編號相同。您只能依上方所列零件編號的數量訂購。

定價

數量 價格
+

品質資訊

等級 HiRel Enhanced Product
RoHS
REACH 受影響
引腳鍍層 / 焊球材質 SNPB
MSL 等級 / 迴焊峰值 Level-3-220C-168 HR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:3A001A2C

更多TMS320F28377D-EP資訊

封裝資訊

封裝 | 引腳 NFBGA (GWT) | 337
作業溫度範圍 (°C) -55 to 125
包裝數量 | 運送包裝 90 | JEDEC TRAY (10+1)

TMS320F28377D-EP 的特色

  • Dual-Core Architecture
    • Two TMS320C28x 32-Bit CPUs
    • 200 MHz
    • IEEE 754 Single-Precision Floating-Point Unit (FPU)
    • Trigonometric Math Unit (TMU)
    • Viterbi/Complex Math Unit (VCU-II)
  • Two Programmable Control Law Accelerators (CLAs)
    • 200 MHz
    • IEEE 754 Single-Precision Floating-Point Instructions
    • Executes Code Independently of Main CPU
  • On-Chip Memory
    • 512KB (256KW) or 1MB (512KW) of Flash (ECC-Protected)
    • 172KB (86KW) or 204KB (102KW) of RAM (ECC-Protected or Parity-Protected)
    • Dual-Zone Security Supporting Third-Party Development
  • Clock and System Control
    • Two Internal Zero-Pin 10-MHz Oscillators
    • On-Chip Crystal Oscillator
    • Windowed Watchdog Timer Module
    • Missing Clock Detection Circuitry
  • 1.2-V Core, 3.3-V I/O Design
  • System Peripherals
    • Two External Memory Interfaces (EMIFs) With ASRAM and SDRAM Support
    • Dual 6-Channel Direct Memory Access (DMA) Controllers
    • Up to 169 Individually Programmable, Multiplexed General-Purpose Input/Output (GPIO) Pins With Input Filtering
    • Expanded Peripheral Interrupt Controller (ePIE)
    • Multiple Low-Power Mode (LPM) Support With External Wakeup
  • Communications Peripherals
    • USB 2.0 (MAC + PHY)
    • Support for 12-Pin 3.3 V-Compatible Universal Parallel Port (uPP) Interface
    • Two Controller Area Network (CAN) Modules (Pin-Bootable)
    • Three High-Speed (up to 50-MHz) SPI Ports (Pin-Bootable)
    • Two Multichannel Buffered Serial Ports (McBSPs)
    • Four Serial Communications Interfaces (SCI/UART) (Pin-Bootable)
    • Two I2C Interfaces (Pin-Bootable)
  • Analog Subsystem
    • Up to Four Analog-to-Digital Converters (ADCs)
      • 16-Bit Mode
        • 1.1 MSPS Each (up to 4.4-MSPS System Throughput)
        • Differential Inputs
        • Up to 12 External Channels
      • 12-Bit Mode
        • 3.5 MSPS Each (up to 14-MSPS System Throughput)
        • Single-Ended Inputs
        • Up to 24 External Channels
      • Single Sample-and-Hold (S/H) on Each ADC
      • Hardware-Integrated Post-Processing of ADC Conversions
        • Saturating Offset Calibration
        • Error From Setpoint Calculation
        • High, Low, and Zero-Crossing Compare, With Interrupt Capability
        • Trigger-to-Sample Delay Capture
    • Eight Windowed Comparators With 12-Bit Digital-to-Analog Converter (DAC) References
    • Three 12-Bit Buffered DAC Outputs
  • Enhanced Control Peripherals
    • 24 Pulse Width Modulator (PWM) Channels With Enhanced Features
    • 16 High-Resolution Pulse Width Modulator (HRPWM) Channels
      • High Resolution on Both A and B Channels of 8 PWM Modules
      • Dead-Band Support (on Both Standard and High Resolution)
    • Six Enhanced Capture (eCAP) Modules
    • Three Enhanced Quadrature Encoder Pulse (eQEP) Modules
    • Eight Sigma-Delta Filter Module (SDFM) Input Channels, 2 Parallel Filters per Channel
      • Standard SDFM Data Filtering
      • Comparator Filter for Fast Action for Out of Range
  • Package Options:
    • 337-Ball New Fine Pitch Ball Grid Array (nFBGA) [GWT Suffix]
    • 176-Pin PowerPAD™ Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) [PTP Suffix]
  • Supports Defense, Aerospace, and Medical Applications:
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Extended (–55°C to 125°C) Temperature Range
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability

TMS320F28377D-EP 的說明

The Delfino™ TMS320F28377D-EP is a powerful 32-bit floating-point microcontroller unit (MCU) designed for advanced closed-loop control applications such as industrial drives and servo motor control; solar inverters and converters; digital power; transportation; and power line communications. Complete development packages for digital power and industrial drives are available as part of the powerSUITE and DesignDRIVE initiatives. While the Delfino product line is not new to the TMS320C2000™ portfolio, the F28377D supports a new dual-core C28x architecture that significantly boosts system performance. The integrated analog and control peripherals also let designers consolidate control architectures and eliminate multiprocessor use in high-end systems.

The dual real-time control subsystems are based on TI’s 32-bit C28x floating-point CPUs, which provide 200 MHz of signal processing performance in each core. The C28x CPUs are further boosted by the new TMU accelerator, which enables fast execution of algorithms with trigonometric operations common in transforms and torque loop calculations; and the VCU accelerator, which reduces the time for complex math operations common in encoded applications.

The F28377D microcontroller features two CLA real-time control coprocessors. The CLA is an independent 32-bit floating-point processor that runs at the same speed as the main CPU. The CLA responds to peripheral triggers and executes code concurrently with the main C28x CPU. This parallel processing capability can effectively double the computational performance of a real-time control system. By using the CLA to service time-critical functions, the main C28x CPU is free to perform other tasks, such as communications and diagnostics. The dual C28x+CLA architecture enables intelligent partitioning between various system tasks. For example, one C28x+CLA core can be used to track speed and position, while the other C28x+CLA core can be used to control torque and current loops.

The TMS320F28377D-EP supports 1MB (512KW) of onboard flash memory with error correction code (ECC) and 204KB (102KW) of SRAM. Two 128-bit secure zones are also available on each CPU for code protection.

Performance analog and control peripherals are also integrated on the F28377D MCU to further enable system consolidation. Four independent 16-bit ADCs provide precise and efficient management of multiple analog signals, which ultimately boosts system throughput. The new sigma-delta filter module (SDFM) works in conjunction with the sigma-delta modulator to enable isolated current shunt measurements. The Comparator Subsystem (CMPSS) with windowed comparators allows for protection of power stages when current limit conditions are exceeded or not met. Other analog and control peripherals include DACs, PWMs, eCAPs, eQEPs, and other peripherals.

Peripherals such as EMIFs, CAN modules (ISO 11898-1/CAN 2.0B-compliant), and a new uPP interface extend the connectivity of the F28377D. The uPP interface is a new feature of the C2000™ MCUs and supports high-speed parallel connection to FPGAs or other processors with similar uPP interfaces. Lastly, a USB 2.0 port with MAC and PHY lets users easily add universal serial bus (USB) connectivity to their application.

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解