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Quality, reliability & packaging data download

BQ40Z50RSMT-R2 ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking BQ40Z50
Lead finish/Ball material NiPdAu
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
6.667x108 1.5 55 60 0.7 125 1000 8576 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.103081
96.546718
965467
0.307594
3076
Not Categorized
Proprietary Materials
—
0.000012
0.011239
112
0.000036
0
Precious Metals
Gold
7440-57-5
0.000626
0.586318
5863
0.001868
19
Precious Metals
Palladium
7440-05-3
0.003047
2.853851
28539
0.009092
91
Precious Metals
Silver
7440-22-4
0.000002
0.001873
19
0.000006
0
Sub-total
— —
0.106768
100
1000000
0.318596
3186
Die Attach Adhesive
Other Inorganic Materials
Aluminum Oxide
1344-28-1
0.085638
30.000000
300000
0.255544
2555
Other Inorganic Materials
Silica
7631-86-9
0.012846
4.500105
45001
0.038332
383
Thermoplastics
Epoxy
85954-11-6
0.186976
65.499895
654999
0.557936
5579
Sub-total
— —
0.285460
100
1000000
0.851813
8518
Die Attach Adhesive 2
Other Inorganic Materials
Aluminum Oxide
1344-28-1
0.09179
29.999967
300000
0.273901
2739
Other Inorganic Materials
Silica
7631-86-9
0.013769
4.500159
45002
0.041087
411
Thermoplastics
Epoxy
85954-11-6
0.200408
65.499874
654999
0.598018
5980
Sub-total
— —
0.305967
100
1000000
0.913006
9130
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
10.550275
99.250000
992500
31.482025
314820
Other Nonferrous Metals and Alloys
Chromium
7440-47-3
0.027638
0.260000
2600
0.082472
825
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.026575
0.250000
2500
0.079300
793
Zinc and Its Alloys
Zinc
7440-66-6
0.025512
0.240000
2400
0.076128
761
Sub-total
— —
10.630000
100
1000000
31.719924
317199
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.180728
95.120000
951200
0.539292
5393
Precious Metals
Gold
7440-57-5
0.001482
0.780000
7800
0.004422
44
Precious Metals
Palladium
7440-05-3
0.00779
4.100000
41000
0.023245
232
Sub-total
— —
0.190000
100
1000000
0.566960
5670
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
16.199718
88.000002
880000
48.339965
483400
Other Organic Materials
Carbon Black
1333-86-4
0.055226
0.299998
3000
0.164794
1648
Other Organic Materials
Chlorine
7782-50-5
0.000184
0.001000
10
0.000549
5
Thermoplastics
Epoxy
85954-11-6
2.153642
11.699000
116990
6.426469
64265
Sub-total
— —
18.408770
100
1000000
54.931777
549318
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.730391
100.000000
1000000
5.163487
51635
Sub-total
— —
1.730391
100
1000000
5.163487
51635
Semiconductor Device 2
Ceramics / Glass
Doped Silicon
7440-21-3
1.854704
100.000000
1000000
5.534437
55344
Sub-total
— —
1.854704
100
1000000
5.534437
55344
Total
— —
33.512060
— —
100
1000000
No results found

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1232 54768 Pass
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28135 458306 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
QFN Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 16668 177751 Pass
QFN High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 13937 166805 Pass
QFN Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 39518 434508 Pass
QFN Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 21168 308384 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.