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Quality, reliability & packaging data download

TL331IDBVT ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking T1I8, T1IU, T1IL, T1IG
Lead finish/Ball material NiPdAu
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.25x108 8.0 55 60 0.7 125 1000 1463 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.014154
97.586873
975869
0.079245
792
Not Categorized
Proprietary Materials
—
0.000002
0.013789
138
0.000011
0
Precious Metals
Palladium
7440-05-3
0.000348
2.399338
23993
0.001948
19
Sub-total
— —
0.014504
100
1000000
0.081205
812
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.039608
74.999527
749995
0.221757
2218
Thermoplastics
Epoxy
85954-11-6
0.013203
25.000473
250005
0.073921
739
Sub-total
— —
0.052811
100
1000000
0.295678
2957
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.334588
97.346496
973465
29.867268
298673
Copper and Its Alloys
Iron
7439-89-6
0.133767
2.441004
24410
0.748934
7489
Copper and Its Alloys
Phosphorus
7723-14-0
0.004521
0.082500
825
0.025312
253
Zinc and Its Alloys
Zinc
7440-66-6
0.007124
0.130000
1300
0.039886
399
Sub-total
— —
5.480000
100
1000000
30.681400
306814
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.042804
95.120000
951200
0.239651
2397
Precious Metals
Gold
7440-57-5
0.000351
0.780000
7800
0.001965
20
Precious Metals
Palladium
7440-05-3
0.001845
4.100000
41000
0.010330
103
Sub-total
— —
0.045000
100
1000000
0.251946
2519
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.68657
88.000004
880000
59.831922
598319
Other Organic Materials
Carbon Black
1333-86-4
0.036431
0.299996
3000
0.203970
2040
Other Organic Materials
Chlorine
7782-50-5
0.000121
0.000996
10
0.000677
7
Thermoplastics
Epoxy
85954-11-6
1.420707
11.699004
116990
7.954248
79542
Sub-total
— —
12.143829
100
1000000
67.990817
679908
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.12484
100.000000
1000000
0.698954
6990
Sub-total
— —
0.12484
100
1000000
0.698954
6990
Total
— —
17.860984
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.015025
97.533268
975333
0.084177
842
Not Categorized
Proprietary Materials
—
0.000002
0.012983
130
0.000011
0
Precious Metals
Gold
7440-57-5
0.000008
0.051931
519
0.000045
0
Precious Metals
Palladium
7440-05-3
0.00037
2.401818
24018
0.002073
21
Sub-total
— —
0.015405
100
1000000
0.086306
863
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.028288
80.000000
800000
0.158482
1585
Thermoplastics
Epoxy
85954-11-6
0.007072
20.000000
200000
0.039620
396
Sub-total
— —
0.035360
100
1000000
0.198102
1981
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.31834
97.050000
970500
29.795680
297957
Copper and Its Alloys
Iron
7439-89-6
0.14248
2.600000
26000
0.798236
7982
Copper and Its Alloys
Phosphorus
7723-14-0
0.00822
0.150000
1500
0.046052
461
Zinc and Its Alloys
Zinc
7440-66-6
0.01096
0.200000
2000
0.061403
614
Sub-total
— —
5.48000
100
1000000
30.701371
307014
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.05
100.000000
1000000
0.280122
2801
Sub-total
— —
0.05
100
1000000
0.280122
2801
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.741291
88.000004
880000
60.177437
601774
Other Organic Materials
Carbon Black
1333-86-4
0.036618
0.300000
3000
0.205150
2052
Other Organic Materials
Chlorine
7782-50-5
0.000122
0.001000
10
0.000683
7
Thermoplastics
Epoxy
85954-11-6
1.427981
11.698997
116990
8.000178
80002
Sub-total
— —
12.206012
100
1000000
68.383448
683834
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.062589
100.000000
1000000
0.350651
3507
Sub-total
— —
0.062589
100
1000000
0.350651
3507
Total
— —
17.849366
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 693 24846 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 6691 118821 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 4501 92148 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 11931 222447 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 8091 177626 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.