Home  >  Quality & reliability  >  Quality, reliability & packaging data download

Quality, reliability & packaging data download

TLV76118DCYR ACTIVE

By using this tool to “search” or “download”, you agree to TI’s terms of use, privacy policy (including cookie policy), and important notice.

Search more parts

Filter between the data types to view or download

Quality data will change based on assembly site

Download .xls Download PDF

Rating

Catalog
RoHS Yes
REACH Yes
Device Marking 76118C
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-2-260C-1 YEAR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1x1010 0.1 55 60 0.7 125 1000 183306 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.078744
97.389153
973892
0.072021
720
Precious Metals
Gold
7440-57-5
0.000173
0.213963
2140
0.000158
2
Precious Metals
Palladium
7440-05-3
0.001938
2.396883
23969
0.001773
18
Sub-total
— —
0.080855
100
1000000
0.073952
740
Die Attach Adhesive
Other Inorganic Materials
Aluminum Oxide
1344-28-1
0.077344
74.900013
749000
0.070741
707
Other Plastics and Rubber
Dicyandiamide
461-58-5
0.000568
0.550052
5501
0.000520
5
Other Plastics and Rubber
Other Filler
—
0.003666
3.550158
35502
0.003353
34
Thermoplastics
Epoxy
85954-11-6
0.021685
20.999777
209998
0.019834
198
Sub-total
— —
0.103263
100
1000000
0.094447
944
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
38.780125
97.437500
974375
35.469327
354693
Copper and Its Alloys
Iron
7439-89-6
0.9353
2.350000
23500
0.855450
8555
Copper and Its Alloys
Phosphorus
7723-14-0
0.032835
0.082500
825
0.030032
300
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.00199
0.005000
50
0.001820
18
Zinc and Its Alloys
Zinc
7440-66-6
0.04975
0.125000
1250
0.045503
455
Sub-total
— —
39.800000
100
1000000
36.402131
364021
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.004
100.000000
1000000
0.003659
37
Sub-total
— —
0.004
100
1000000
0.003659
37
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
61.965366
89.850000
898500
56.675161
566752
Other Organic Materials
Carbon Black
1333-86-4
0.103448
0.150000
1500
0.094616
946
Other Organic Materials
Organic Phosphorus
1330-78-5
0.344827
0.500000
5000
0.315388
3154
Thermoplastics
Epoxy
85954-11-6
6.551708
9.500000
95000
5.992365
59924
Sub-total
— —
68.965349
100
1000000
63.077530
630775
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.38079
100.000000
1000000
0.348281
3483
Sub-total
— —
0.38079
100
1000000
0.348281
3483
Total
— —
109.334257
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28135 458229 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 6691 118821 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 4501 92148 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 11931 222447 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 8091 177626 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

Close

Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.