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Quality, reliability & packaging data download

REF54500CFKHT ACTIVE

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Rating

Catalog
REACH Affected
Device Marking R5450NRF
Lead finish/Ball material —
MSL rating/Peak reflow Level-NC-NC-NC

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
5.97x108 1.7 55 60 0.7 125 1000 6973 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Not Categorized
Proprietary Materials
—
0.000005
0.005221
52
0.000005
0
Precious Metals
Gold
7440-57-5
0.095762
99.994779
999948
0.090285
903
Sub-total
— —
0.095767
100
1000000
0.090290
903
Die Attach Adhesive
Not Categorized
Phenolic Resin
9003-35-4
0.127028
19.000012
190000
0.119763
1198
Other Inorganic Materials
Inorganic Filler
—
0.006686
1.000048
10000
0.006304
63
Other Plastics and Rubber
Other Filler
—
0.006686
1.000048
10000
0.006304
63
Precious Metals
Silver
7440-22-4
0.528168
78.999892
789999
0.497962
4980
Sub-total
— —
0.668568
100
1000000
0.630332
6303
Header - Ceramic
Magnesium and Its Alloys
Magnesium Oxide
1309-48-4
0.29865
0.500000
5000
0.281570
2816
Other Inorganic Materials
Aluminum Oxide
1344-28-1
54.05565
90.500000
905000
50.964191
509642
Other Inorganic Materials
Silicon Dioxide
7631-86-9
2.102496
3.520000
35200
1.982254
19823
Other Nonferrous Metals and Alloys
Calcium Oxide
1305-78-8
0.364353
0.610000
6100
0.343516
3435
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
2.311551
3.870000
38700
2.179353
21794
Other Nonferrous Metals and Alloys
Titanium Dioxide
13463-67-7
0.5973
1.000000
10000
0.563140
5631
Sub-total
— —
59.730000
100
1000000
56.314023
563140
Header - Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.088
56.082474
560825
1.025777
10258
Other Nonferrous Metals and Alloys
Cobalt
7440-48-4
0.272
14.020619
140206
0.256444
2564
Other Nonferrous Metals and Alloys
Thallium
7440-28-0
0.000012
0.000619
6
0.000011
0
Precious Metals
Gold
7440-57-5
0.579988
29.896289
298963
0.546818
5468
Sub-total
— —
1.940000
100
1000000
1.829051
18291
Header - Routing
Other Nonferrous Metals and Alloys
Molybdenum
7439-98-7
0.2613
3.000000
30000
0.246356
2464
Other Nonferrous Metals and Alloys
Tungsten
7440-33-7
8.4487
97.000000
970000
7.965516
79655
Sub-total
— —
8.7100
100
1000000
8.211872
82119
Lid
Copper and Its Alloys
Iron
7439-89-6
14.3608
58.000000
580000
13.539502
135395
Nickel and Its Alloys
Nickel
7440-02-0
10.3992
42.000000
420000
9.804467
98045
Sub-total
— —
24.7600
100
1000000
23.343968
233440
Lid - Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.2
100.000000
1000000
1.131372
11314
Sub-total
— —
1.2
100
1000000
1.131372
11314
Lid - Seal
Other Nonferrous Metals and Alloys
Indium
7440-74-6
0.1116
1.800000
18000
0.105218
1052
Other Nonferrous Metals and Alloys
Lead
7439-92-1
5.6668
91.400000
914000
5.342714
53427
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.2666
4.300000
43000
0.251353
2514
Precious Metals
Silver
7440-22-4
0.155
2.500000
25000
0.146136
1461
Sub-total
— —
6.2000
100
1000000
5.845420
58454
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.761608
100.000000
1000000
2.603671
26037
Sub-total
— —
2.761608
100
1000000
2.603671
26037
Total
— —
106.065943
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
High-Precision CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 2926 64347 Pass
Assembly process reliability data
Package Family Reliability Test Cumulative Sample Size Disposition
LCCC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 312 Pass
LCCC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 1333 Pass
LCCC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 1886 Pass
LCCC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 788 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.