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Quality, reliability & packaging data download

TLV2711CDBVR ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking VAJC
Lead finish/Ball material NiPdAu
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
5.97x108 1.7 55 60 0.7 125 1000 6973 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Precious Metals
Gold
7440-57-5
0.025795
100.000000
1000000
0.146781
1468
Sub-total
— —
0.025795
100
1000000
0.146781
1468
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.15088
80.000000
800000
0.858550
8585
Thermoplastics
Epoxy
85954-11-6
0.03772
20.000000
200000
0.214637
2146
Sub-total
— —
0.18860
100
1000000
1.073187
10732
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.651665
97.442500
974425
32.159565
321596
Copper and Its Alloys
Iron
7439-89-6
0.1363
2.350000
23500
0.775585
7756
Copper and Its Alloys
Phosphorus
7723-14-0
0.004785
0.082500
825
0.027228
272
Zinc and Its Alloys
Zinc
7440-66-6
0.00725
0.125000
1250
0.041255
413
Sub-total
— —
5.800000
100
1000000
33.003633
330036
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.00038
95.238095
952381
0.002162
22
Precious Metals
Gold
7440-57-5
0.000003
0.751880
7519
0.000017
0
Precious Metals
Palladium
7440-05-3
0.000016
4.010025
40100
0.000091
1
Sub-total
— —
0.000399
100
1000000
0.002270
23
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
9.449316
85.999998
860000
53.769268
537693
Other Organic Materials
Carbon Black
1333-86-4
0.054938
0.500001
5000
0.312613
3126
Thermoplastics
Epoxy
85954-11-6
1.483323
13.500001
135000
8.440525
84405
Sub-total
— —
10.987577
100
1000000
62.522406
625224
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.571452
100.000000
1000000
3.251723
32517
Sub-total
— —
0.571452
100
1000000
3.251723
32517
Total
— —
17.573823
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.014467
97.532529
975325
0.079407
794
Not Categorized
Proprietary Materials
—
0.000002
0.013483
135
0.000011
0
Precious Metals
Gold
7440-57-5
0.000008
0.053934
539
0.000044
0
Precious Metals
Palladium
7440-05-3
0.000356
2.400054
24001
0.001954
20
Sub-total
— —
0.014833
100
1000000
0.081416
814
Die Attach Adhesive
Not Categorized
Phenolic Resin
9003-35-4
0.003448
6.000696
60007
0.018926
189
Other Inorganic Materials
Aluminum Oxide
1344-28-1
0.043038
74.900801
749008
0.236229
2362
Other Organic Materials
Carbon Black
1333-86-4
0.000057
0.099199
992
0.000313
3
Other Plastics and Rubber
Dicyandiamide
461-58-5
0.000287
0.499478
4995
0.001575
16
Other Plastics and Rubber
Other Filler
—
0.005459
9.500522
95005
0.029964
300
Thermoplastics
Epoxy
85954-11-6
0.005171
8.999304
89993
0.028383
284
Sub-total
— —
0.057460
100
1000000
0.315389
3154
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.301681
96.745986
967460
29.100131
291001
Copper and Its Alloys
Iron
7439-89-6
0.12604
2.300000
23000
0.691815
6918
Copper and Its Alloys
Phosphorus
7723-14-0
0.001699
0.031004
310
0.009326
93
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.000055
0.001004
10
0.000302
3
Precious Metals
Silver
7440-22-4
0.04384
0.800000
8000
0.240631
2406
Zinc and Its Alloys
Zinc
7440-66-6
0.006686
0.122007
1220
0.036698
367
Sub-total
— —
5.480001
100
1000000
30.078903
300789
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.412
100.000000
1000000
2.261406
22614
Sub-total
— —
0.412
100
1000000
2.261406
22614
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.640721
88.000003
880000
58.405320
584053
Other Organic Materials
Carbon Black
1333-86-4
0.036275
0.299998
3000
0.199108
1991
Other Organic Materials
Chlorine
7782-50-5
0.000121
0.001001
10
0.000664
7
Thermoplastics
Epoxy
85954-11-6
1.414611
11.698998
116990
7.764587
77646
Sub-total
— —
12.091728
100
1000000
66.369680
663697
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.162731
100.000000
1000000
0.893206
8932
Sub-total
— —
0.162731
100
1000000
0.893206
8932
Total
— —
18.218753
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
High-Precision CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 2313 62576 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 8070 115579 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 6141 90589 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 18991 216284 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 11781 173616 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.