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BDE-3P-CC2755P20-MODULES
BDE CC2755P20 modules with PCB antenna, UFL connector, RF PIN, 105°C working temp
BDE-3P-CC2755P20-MODULES
Overview
The BDE-MP2755P20 series are high-performance 2.4GHz multiprotocol wireless MCU modules powered by TI’s CC2755P20 single-chip solution. Featuring an Arm Cortex-M33 processor and a fully qualified Bluetooth® 6.0 stack, they operate independently without an external MCU. With 2MB of on-chip flash, they offer massive storage for large firmware, concurrent multi-protocol operation, dual-bank OAD backup, and edge-AI deployment. They support Bluetooth 6.0 LE, Zigbee 3.0, Thread 1.3, Matter 1.2, and proprietary protocols.
Designed for rapid integration, the modules include antennas, filters, and dual clocks, delivering +20dBm transmit power and -103.5dBm sensitivity. They excel in advanced BLE 6.0 tasks like Channel Sounding for precise ranging. With ultra-low standby current and 162KB RAM retention, they ensure superior battery life. Pre-certified (FCC, ISED, CE, Bluetooth SIG), they are perfect for smart homes, industrial IoT, medical, and consumer tech.
Features
- Bluetooth 6.0 qualified: Full support for Bluetooth 6.0 features, including long-range Coded PHYs, high-speed 2Mbit PHYs, advertising extensions, and up to 32 concurrent multirole connections.
- Hardware accelerated Channel Sounding: Features a dedicated Algorithm Processing Unit (APU) to execute signal processing (FFT, super-resolution algorithms like MUltiple SIgnal Classification (MUSIC), and neural networks).
- Multiprotocol wireless engine: Supports Bluetooth 6.0 Low Energy, Zigbee 3.0, Thread 1.3, Matter 1.2, and proprietary protocols.
- Robust RF power & sensitivity: TX output power up to +20dBm and receiver sensitivity up to -103.5dBm on 125kbps BLE Coded PHY.
- Ultra-low power management: Consumes an extremely low 0.9µA standby current with active Real-Time Clock (RTC) and full 162KB SRAM retention, dropping down to 160nA in complete shutdown.
- Lots of memory: Packed with 2MB of Flash and 162KB of RAM. Optional additional 32Mbit flash.
- Flexible antenna options: Supports integrated PCB trace antenna, U.FL connector and ANT pin.
- Pre-certified: FCC, IC, CE and Bluetooth SIG certified. Enables fast time to market.
- BDE-MP2755P20A32: PCB Trace Antenna, 32Mbit SPI Flash, up to +85°C operating
- BDE-MP2755P20U32: U.FL Connector, 32Mbit SPI Flash, up to +85°C operating
- BDE-MP2755P20N32: ANT Pin, 32Mbit SPI Flash, up to +85°C operating
- BDE-MP2755P20A0: PCB Trace Antenna, up to +85°C operating
- BDE-MP2755P20U0: U.FL Connector, up to +85°C operating
- BDE-MP2755P20N0: ANT Pin, up to +85°C operating
- BDE-MP2755P20A32-IN: PCB Trace Antenna, 32Mbit SPI Flash, up to +105°C operating
- BDE-MP2755P20U32-IN: U.FL Connector, 32Mbit SPI Flash, up to +105°C operating
- BDE-MP2755P20N32-IN: ANT Pin, 32Mbit SPI Flash, up to +105°C operating
- BDE-MP2755P20A0-IN: PCB Trace Antenna, up to +105°C operating
- BDE-MP2755P20U0-IN: U.FL Connector, up to +105°C operating
- BDE-MP2755P20N0-IN: ANT Pin, up to +105°C operating
Photos courtesy of BDE Technology Inc.
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BDE-MP2755P20 — BDE CC2755P20 modules with PCB antenna (A), UFL connector (U), RF PIN (N), 105℃ working temp (-IN)
BDE-MP2755P20 — BDE CC2755P20 modules with PCB antenna (A), UFL connector (U), RF PIN (N), 105℃ working temp (-IN)
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