BEACN-3P-TORPEDO-WIRELESS

Beacon EmbeddedWorks DM3730 and AM3703 Torpedo™ + wireless system-on-module (SoM)

BEACN-3P-TORPEDO-WIRELESS

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Overview

The DM3730/AM3703 Torpedo™ + Wireless System-on-Module (SoM) combines Texas Instruments DaVinci™ DM3730 and Sitara™ AM3703 processing technology with integrated Wi-Fi® and Bluetooth® connectivity in an ultra-compact 15 mm x 27 mm form factor. By integrating processor, memory, power management, and wireless functionality into a single module, the Torpedo + Wireless helps engineers reduce design complexity, accelerate development, and minimize board space requirements. The DM3730 version features a 1 GHz Arm® Cortex®-A8 processor, TMS320C64x+™ DSP, and PowerVR SGX™ graphics accelerator, enabling multimedia, display, and connected edge applications that require high performance and low power consumption. Production-ready Linux®, Android™, and Windows Embedded CE BSPs help shorten development cycles, while support for display, audio, USB, serial, and expansion interfaces enables rapid integration into embedded designs. The Torpedo + Wireless is well suited for portable medical devices, industrial equipment, handheld systems, and other connected applications where size, performance, power efficiency, and reliable wireless communication are critical.

Features
  • Processor
    • Supports Texas Instruments DaVinci DM3730 or Sitara AM3703 processors running up to 1 GHz
    • IVA2.2 Subsystem TMS320C64x+™ DSP core running up to 800 MHz and supporting multiple codecs (DM3730 only)
    • POWER SGX™ Graphics Accelerator (DM3730 only)
  • Embedded Memory
    • Mobile DDR SDRAM / NAND flash memory (PoP technology)
      • 256 MB / 512 MB
      • 512 MB / 512 M
    • Boots from NAND flash or external SD card
  • Serial I/O
    • (3) UARTs
    • (2) McBSPs
    • (3) SPI, (2) I2C
  • USB
    • USB 2.0 high-speed On-the-Go interface
  • Display
    • Programmable color LCD controller supports up to 24 bpp TFT interface
    • Hardware supports XGA 1024×768 at 24-bit color
    • TV-out / S-Video interface
  • Audio
    • I2S compliant audio codec (TI TPS65950 – 16-bit stereo DAC, 13-bit ADC)
  • PC Card Expansion
    • Multiple MMC/SD card support
  • Mechanical Specifications
    • Ultra-compact Torpedo SOM form factor (15 x 27 x 3.8 mm)
    • Commercial temperature (0°C to +70°C)
    • Industrial temperature (-40°C to +85°C)
    • Extended temperatue (-40°C to +70°C)
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Photos courtesy of Beacon EmbeddedWorks

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Evaluation board

SOMAM3703-32-1780AKIR — Beacon EmbeddedWorks AM3703 Torpedo™ + wireless industrial temperature system-on-module (SoM)

Supported products & hardware

SOMAM3703-32-1780AKIR Beacon EmbeddedWorks AM3703 Torpedo™ + wireless industrial temperature system-on-module (SoM)

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Evaluation board

SOMDM3730-32-1780AKIR — Beacon EmbeddedWorks DM3730 Torpedo™ + wireless industrial temperature system-on-module (SoM)

Supported products & hardware

SOMDM3730-32-1780AKIR Beacon EmbeddedWorks DM3730 Torpedo™ + wireless industrial temperature system-on-module (SoM)

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Evaluation board

SOMDM3730-32-2780AKCR — Beacon EmbeddedWorks DM3730 Torpedo™ + wireless commercial temperature system-on-module (SoM)

Supported products & hardware

SOMDM3730-32-2780AKCR Beacon EmbeddedWorks DM3730 Torpedo™ + wireless commercial temperature system-on-module (SoM)

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TI's Standard Terms and Conditions for Evaluation Items apply.

Support & training

Third-party support
TI does not offer ongoing direct design support for this hardware. For support while working through your design, contact Beacon EmbeddedWorks.

Videos

Disclaimer

Certain information and resources (including links to non-TI sites) above may be provided by a third-party partner, and is included here merely for your convenience. TI is not the provider of, and is not responsible for, the content of such information and resources, and you should evaluate them carefully for your intended uses and on your own behalf. The inclusion of such information and resources here does not imply endorsement of any third-party company by TI, and shall not be construed as a warranty or representation regarding the suitability of any third-party products or services, either alone or in combination with any TI product or service.