Peak efficiency at 99%, 585-W high-voltage buck reference design with standard Si-MOSFETs


Design files


This reference design converts a DC-input source in the range of 450 V to 780 V into non-isolated 390 V at 1.5 A. This is an alternative solution to SiC-FET and SiC-Diode buck converter, since the actual power stage uses only standard silicon components. In order to employ 600 V rated devices, the input source has been split so that two identical buck stages share the center point. A single coupled inductor (1:1) balances automatically the center point. Two small-series inductors limit the current in each branch in case of voltage imbalance and any small variation in the gate drive delay time of the two FETs. The converter minimizes the switching loss as a result of CRM mode (critical conduction mode), achieving peak efficiency of 99% at 450 V input voltage and full load.

  • Overall efficiency of 98% at full load with peak efficiency at 99%
  • Non-SiC silicon components used to lower overall BOM cost
  • No heat sink is necessary due to very high efficiency
  • Self-balancing center point thanks to coupled inductor
Output voltage options PMP30446.1
Vin (Min) (V) 450
Vin (Max) (V) 780
Vout (Nom) (V) 390
Iout (Max) (A) 1.5
Output Power (W) 585
Isolated/Non-Isolated Non-Isolated
Input Type DC
Topology Buck- Non Sync
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDT177.PDF (1104 K)

Test results for the reference design, including efficiency graphs, test prerequisites and more

TIDM559.PDF (345 K)

Detailed schematic diagram for design layout and components

TIDM560.PDF (137 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDM561.PDF (347 K)

Detailed overview of design layout for component placement

TIDM563.ZIP (1016 K)

Files used for 3D models or 2D drawings of IC components


Design file that contains information on physical board layer of design PCB

TIDM562.PDF (1411 K)

PCB layer plot file used for generating PCB design layout


Includes TI products in the design and potential alternatives.

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Technical documentation

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* Test report Peak Efficiency at 99%, 585-W High-Voltage Buck Reference Design Apr. 24, 2020

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