Distance and Weight Measurement Using Inductive Sensing Reference Design


Design files


The Distance and Weight Measurement Using Inductive Sensing Reference Design is a sub-system design which converts a distance measurement to a weight measurement. This design is intended as a reference design for building automation and weigh scale applications. In mechanical systems, there are many situations that require precise and accurate measurements of distance. One such scenario is the conversion of a distance measurement to a weight measurement, through the use of springs with well-known characteristics. This reference design enables weight and distance measurements to be incorporated into end systems, without the use of expensive magnets or other sensing materials.

  • Sensor coil input customized for mechanical system from WEBENCH® Inductive Sensing Designer
  • Calibrated sensor output from microcontroller
  • Low power consumption of 37.8 mW
  • Output resolution: 2 g
  • Typical System Error: 4.2 g (600 g to 650 g)
  • IEC61000-4-2: ESD: Air Discharge: ±8 kV Class A
  • IEC61000-4-4: EFT ±2 kV Class A
??image.gallery.download_en_US?? View video with transcript Video

A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDU367.PDF (3779 K)

Reference design overview and verified performance test data

TIDR844.PDF (252 K)

Detailed schematic diagram for design layout and components

TIDR845.PDF (60 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDR846.PDF (171 K)

Detailed overview of design layout for component placement

TIDR848.ZIP (900 K)

Files used for 3D models or 2D drawings of IC components

TIDR849.ZIP (11 K)

Files used for 3D models or 2D drawings of IC components

TIDC500.ZIP (409 K)

Design file that contains information on physical board layer of design PCB

TIDR847.PDF (620 K)

PCB layer plot file used for generating PCB design layout


Includes TI products in the design and potential alternatives.

Digital temperature sensors

TMP103±2°C Digital temperature sensor with I2C/SMBus capable of 1.4V in WCSP

Data sheet: PDF | HTML
Inductive sensor AFEs

LDC10411-Ch, 5V, 24-bit L, 8-bit Rp, inductance to digital converter

Data sheet: PDF | HTML
Linear & low-dropout (LDO) regulators

TPS7A410150-mA, 50-V, low-IQ, adjustable low-dropout voltage regulator with enable

Data sheet: PDF | HTML
MSP430 microcontrollers

MSP430F523225 MHz MCU with 64KB Flash, 8KB SRAM, comparator, DMA, UART/SPI/I2C, timer, HW multiplier

Data sheet: PDF

Start development


Technical documentation

= Top documentation selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Design guide Distance and Weight Measurement Using Inductive Sensing Design Guide May 28, 2014

Related design resources

Reference designs

TIDA-00314 Touch on Metal Buttons With Integrated Haptic Feedback Reference Design

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​