ADAS Sensor Interconnect Reference Design Board for Remote Camera and Radar Modules


Design files


The ADAS Sensor Interconnect Board is intended for applications where remote sensors like cameras, LIDAR or radar modules need to be connected to a central processing ECU. The board supports up to 3 coaxial and 1 LVDS twisted pair data inputs as well as 3 FMC cable and 1 board to board connector as data outputs to a processing ECU.  Camera or other sensor modules connected through the coax connector (SMB standard) are powered directly via the coaxial cable (power over coax) from the interconnect board. Because of an independent complete power solution for all ICs and power over coax on board, a single car battery or similar wide voltage supply can be directly connected to the power connector on the ADAS Sensor Interconnect Board. An on-board uC and LIN interface allow control and configuration of the Interconnect board as well as plug-and-play operation.

  • 3 High Speed FPD-III serial inputs each supporting a camera with bidirectional control, power and video link on a single coax cable with up to 1.4Gbps
  • Supplies up to 3 remote camera modules via power over coax (5V or 8V selectable)
  • Additional FPD-III serial input supporting a remote radar module with bidirectional control and 3Gbps data using STP cable
  • Built in self test (BIST) of all 4 serial inputs
  • Module can be supplied with a single voltage or directly from the car battery
  • This circuit is tested and includes Design considerations
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    A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

    Design files & products

    Design files

    Download ready-to-use system files to speed your design process.

    TIDU507.PDF (330 K)

    Test results for the reference design, including efficiency graphs, test prerequisites and more

    TIDRA74.PDF (1609 K)

    Detailed schematic diagram for design layout and components

    TIDRAA0.PDF (228 K)

    Complete listing of design components, reference designators, and manufacturers/part numbers

    TIDC587.ZIP (4203 K)

    Design file that contains information on physical board layer of design PCB


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    Technical documentation

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    Type Title Date
    User guide TIDA-00271 Design Considerations Aug. 26, 2014
    Test report TIDA-00271 Test Images Aug. 26, 2014

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