IO-Link Sensor Transmitter Booster Pack
TIDA-00339
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Description & Features

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Key Document

Description

This TI Design offers a rapid prototyping platform for IO-Link sensor transmitter. Thanks to its design it can be connected to TIs LaunchPad / BoosterPack ecosystem on which the fully validated IO-Link stack is implemented. The system has easy access to all interface and status signals. The different optional settings make the TI Design flexible to adjust for several use cases. With the ability to connect sensor front-ends the design can be used either as an evaluation platform of the IO-Link interface or as an entire sensor transmitter system. With the industry standard M12 connector the sub-system can be quickly connected to an IO-Link Master System.

For more information on TMG:  Click here.

Features
  • IO-Link v1.1 and v1.0 Connectivity Out of the Box (TMG stack, PHY and M12 connector)
  • Simple Interfacing of Sensors
  • Designed to meet:
    • IEC 61000-4-2
    • IEC 61000-4-4
    • IEC 61000-4-5
    • IEC 60255-5

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Schematic/Block Diagram

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Design Files

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TI Devices (2)

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Part Number Name Product Family Sample & Buy Design Kits & Evaluation Modules
SN65HVD102  IO-Link PHY for device nodes  Interface  Sample & Buy View Design Kits & Evaluation Modules
TPS7A16  60-V, 5-µA IQ, 100-mA low-dropout (LDO) voltage regulator with enable and power good  Power management  Sample & Buy View Design Kits & Evaluation Modules

CAD/CAE symbols

Part # Package | Pins CAD File (.bxl) STEP Model (.stp)
TPS7A16 Download Download
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Technical Documents

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User guides (1)
Title Type Size (KB) Date
PDF 3045 29 Mar 2016
Design files (6)
Title Type Size (KB) Date
ZIP 459 12 Dec 2014
ZIP 1559 12 Dec 2014
PDF 1111 12 Dec 2014
PDF 117 12 Dec 2014
PDF 86 12 Dec 2014
PDF 929 12 Dec 2014
Related Tools & Software

Reference Designs  ( 1 )

Name Part Number Tool Type
IO-Link Sensor Transmitter Reference Design  TIDA-00188  TI Designs

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