This reference design offers a rapid prototyping platform for IO-Link sensor transmitters. Due to its design, it can be connected to TI LaunchPad / BoosterPack ecosystem on which the fully-validated IO-Link stack is implemented. The design has easy access to all interface and status signals. The different optional settings make this design flexible to adjust for several use cases. With the ability to connect sensor front-ends, the design can be used either as an evaluation platform of the IO-Link interface or as an entire sensor transmitter system. With the industry standard M12 connector, it can be connected to an IO-Link master system.
See more information on TMG.
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
Download ready-to-use system files to speed your design process.
Reference design overview and verified performance test data
Detailed schematic diagram for design layout and components
Complete listing of design components, reference designators, and manufacturers/part numbers
Detailed overview of design layout for component placement
Files used for 3D models or 2D drawings of IC components
Design file that contains information on physical board layer of design PCB
PCB layer plot file used for generating PCB design layout
Includes TI products in the design and potential alternatives.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Design guide | IO-Link PHY BoosterPack (Rev. B) | Mar. 29, 2016 |
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