This reference design offers a rapid prototyping platform for IO-Link sensor transmitters. Due to its design, it can be connected to TI LaunchPad / BoosterPack ecosystem on which the fully-validated IO-Link stack is implemented. The design has easy access to all interface and status signals. The different optional settings make this design flexible to adjust for several use cases. With the ability to connect sensor front-ends, the design can be used either as an evaluation platform of the IO-Link interface or as an entire sensor transmitter system. With the industry standard M12 connector, it can be connected to an IO-Link master system.
See more information on TMG.
- IO-Link v1.1 and v1.0 connectivity out-of-the-box (TMG stack, PHY and M12 connector)
- Simple interfacing of sensors
- Designed to meet:
- IEC 61000-4-2
- IEC 61000-4-4
- IEC 61000-4-5
- IEC 60255-5